Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models

10/30/2024 | TrendForce
TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

NEOTech Announces Implementation of Enhanced Wire Bonding Process to Boost Microelectronics Manufacturing Efficiency

10/08/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies.

iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series

09/19/2024 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.

iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita

09/09/2024 | iNEMI
iNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.

ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

07/24/2024 | ASMPT
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in