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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 8, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.
Real Time with... SMTAI 2024: John Johnson on American Standard Circuits' Advanced Technology
Published November 6
In this interview from SMTAI 2024, American Standard Circuits' John Johnson details a conversation that starts with the news of a new LED imager and pivots to a peek into American Standard's capabilities roadmap for the next three years. Click to listen now.
Biden-Harris Administration to Invest $825 Million in First CHIPS for America R&D Facility
Published November 1
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility—within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.
Solid-State Batteries Enter Pilot Production, Costs Expected to Drop to CNY 0.6–0.7/Wh by 2035
Published November 1
Battery technology not only continues to develop but is accelerating, according to TrendForce. Learn more about how SSBs will change in the next 10 years.
Real Time with... SMTAI 2024: SPEA Brings Added Sophistication to Board Testing Capabilities
Published November 5
Nolan Johnson spoke with Luca Fanelli from SPEA at SMTAI 2024. In this interview, Fanelli describes SPEA's new AI-based optical inspection technology and shares a powerful example from the field. He also updates Nolan Johnson on SPEA's organizational growth meant to improve customer value. Click here to listen.
Root-cause Analysis and Problem-solving
Published November 1
Happy Holden’s article in October’s PCB007 Magazine pulls from more detailed information in his book, 24 Essential Skills for Engineers, the books section). If your job involves problem solving and root cause analysis, it’s a useful read. And check out the book, too.
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AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/17/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
At KYZEN, Cleaning is All About Reliability
04/17/2026 | Real Time with... APEX EXPOJason Schwartz discusses KYZEN's advanced cleaning solutions for PCB assembly with Dan Beaulieu at APEX EXPO 2026. KYZEN has a 35-year legacy in defluxing, innovative real-time process control, and commitment to ensuring electronic reliability. How KYZEN partners with manufacturers through process audits and lab testing to maintain optimal cleaning standards is part of this conversation.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.