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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 8, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute

In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.
Real Time with... SMTAI 2024: John Johnson on American Standard Circuits' Advanced Technology
Published November 6
In this interview from SMTAI 2024, American Standard Circuits' John Johnson details a conversation that starts with the news of a new LED imager and pivots to a peek into American Standard's capabilities roadmap for the next three years. Click to listen now.
Biden-Harris Administration to Invest $825 Million in First CHIPS for America R&D Facility
Published November 1
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility—within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.
Solid-State Batteries Enter Pilot Production, Costs Expected to Drop to CNY 0.6–0.7/Wh by 2035
Published November 1
Battery technology not only continues to develop but is accelerating, according to TrendForce. Learn more about how SSBs will change in the next 10 years.
Real Time with... SMTAI 2024: SPEA Brings Added Sophistication to Board Testing Capabilities
Published November 5
Nolan Johnson spoke with Luca Fanelli from SPEA at SMTAI 2024. In this interview, Fanelli describes SPEA's new AI-based optical inspection technology and shares a powerful example from the field. He also updates Nolan Johnson on SPEA's organizational growth meant to improve customer value. Click here to listen.
Root-cause Analysis and Problem-solving
Published November 1
Happy Holden’s article in October’s PCB007 Magazine pulls from more detailed information in his book, 24 Essential Skills for Engineers, the books section). If your job involves problem solving and root cause analysis, it’s a useful read. And check out the book, too.
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Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.