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The Knowledge Base: The Era of Advanced Packaging

12/23/2024 | Mike Konrad -- Column: The Knowledge Base
The semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.

Teledyne FLIR, VSI Labs Testing Shows How Thermal Imaging Helps Vehicle Makers Meet Nighttime AEB Federal Safety Standards

12/12/2024 | BUSINESS WIRE
Teledyne FLIR OEM, part of Teledyne Technologies Incorporated, in collaboration with VSI Labs today issued test results utilizing the new Federal Motor Vehicle Safety Standard (FMVSS) No. 127 pedestrian automatic emergency braking (PAEB) testing scenarios.

GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System

11/19/2024 | Gen3
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

11/14/2024 | KIC
KIC, the leader in smart thermal process technologies for electronics manufacturing, announces the launch of its TAS Software (Thermal Analysis System Software), an advanced solution designed to tackle new industry challenges and provide fresh opportunities in thermal profiling.
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