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Ventec to Become Primary PCB Materials Supplier for Teltonika

11/13/2024 | Ventec
Ventec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.

An Update on USPAE's Strategic Initiatives

11/12/2024 | Marcy LaRont, I-Connect007
James Will became executive director of the U.S. Partnership for Assured Electronics (USPAE) in May and now provides this update on the group's strategic initiatives. The organization, which is affiliated with IPC, recently transitioned to being a 501(c)(3). It is navigating through a dynamic landscape, working to enhance our microelectronics manufacturing capabilities including PCBs, and adapt to emerging technology trends and market challenges.

SIA Applauds CHIPS Act Incentives for Corning and Powerex

11/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce for Corning and Powerex.

Infineon, Stellantis to Advance Innovation in Power Conversion and Distribution for Vehicle Architectures

11/08/2024 | Infineon
Stellantis N.V. and Infineon Technologies AG announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.

DRAM Suppliers Must Carefully Plan Capacity to Maintain Profitability Amid Rising Bit Output in 2025

11/06/2024 | TrendForce
The DRAM industry experienced inventory reductions and price recovery in the first three quarters of 2024; however, pricing momentum is expected to weaken in the fourth quarter.
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