-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 10, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 3 minutes

“Baby, it’s cold outside!” Though certain holiday tunes are still lingering in my head, we are indisputably in the new year. For our companies, we are just warming up (pun intended) for the year as, for the first time in nearly two months, all of us are finally back in the office. So, let the productivity (re)commence.
In the past couple of weeks, we’ve had some big industry news. In the automotive world, Honda and Nissan merged to form the largest car manufacturer in Japan. Before President Biden left office, he made sure to distribute more CHIPS Act money to bring some measure of electronics manufacturing back to the U.S. And former President Jimmy Carter died at the age of 100 and was honored on Thursday, reminding us all what true integrity looks like.
For the electronics manufacturing industry, here are my must-reads for the week.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Published January 7
Vern Solberg’s column seems a fitting article to feature, highlighting the impact of semiconductor packaging requirements on the printed circuit board, and advising PCB designers on the best way to approach their delicate work given the many requirements in front of them. Not surprisingly, he spends a fair amount of time talking about stackups and the need (or not) to work with the fabrication facility, but also highlights that most CAD tools now offer the ability for designers to provide a stackup to the fabricator, though it may well change in the fabricator’s hands. If you are a PCB designer, or a fabricator looking for a better understanding of the designers providing you with data, take a few minutes for this read.
Expansion, Retirement, and New Leadership at FCT
Published January 9
Flexible circuit board supplier Flexible Circuit Technologies (FCT)’s Carey Burkett talks about his company’s plans as they enter a new year. He has announced his eventual retirement and brought EMS professional Ray Cottrell into the FCT fold to transition into Carey’s role and develop FCT’s EMS and inTflex integrated solutions offering to customers. Their enthusiasm and passion were evident throughout our interview. I will be watching to see all they accomplish in 2025 and beyond.
EMS Providers Should ‘Plan Prudently’ in 2025
Published January 8
In his interview with Dennis Reed of Edgewater Research and IPC’s Mark Wolfe, Nolan Johnson tackles the question as to what EMS providers should plan for in 2025. He cites such situations as the change in the U.S. administration, tariffs, how company spending will be affected by economics, nearshoring and the relationship between China and the West, industry competition, supply chains, and more. This is a great market outlook piece and valuable read.
American Standard Circuits’ Anaya Vardya to Keynote PanPac Summit 2025
Published January 9
Amidst the lineup of winter tradeshows is the PanPac Summit, held each year in Hawaii. This year, the keynote speaker will be Anaya Vardya, CEO of American Standard Circuits (ASC). Anaya has been an innovator in the PCB sector from the moment he joined the industry, and his work in the UHDI space is notable. The keynote takes place Jan. 28 and is titled “Ultra High-Density Interconnects (UHDI): A Global Innovation in Electronics Assembly.”
It’s Only Common Sense: Making 2025 the Best Sales Year Ever
Published January 6
Fan favorite, Dan Beulieu’s column this week is bound to get some attention. As we each embark on 2025, we are all focused on sales and revenue. Given all the economic realities with which we must contend, any wisdom Dan can impart as to how we might make 2025 the best sales year ever are certainly welcome. Dan gives 10 tips to help assure success. It is advice worth heeding.
Marcy LaRont Named I-Connect007 Executive Director
Published January 8
As a bonus sixth item this past week, I want to highlight a significant leadership change at I-Connect007. Barry Matties, who has been an industry publisher since 1986, will remain as executive director for several months as I now succeed him. Barry’s long service to the industry has played a foundational role in setting a standard for electronics manufacturing trade media. As I now lead this organization, I look forward to all that is ahead for I-Connect007 publications and products and continuing to provide you with the highest level of news, technical, and business information you have come to count on. Please know that I welcome your feedback and input. Contact me at marcy@iconnect007.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.