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Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging

02/11/2026 | Brian Buyea -- Column: Powering the Future
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.

Survey Says: Avnet's Insights Into How Engineers Are Adopting AI

02/09/2026 | Nolan Johnson, I-Connect007
Avnet regularly surveys engineers to learn what they’re thinking. That sort of information is quite important to Alex Iuorio, vice president of supplier development at Avnet. In this interview, Alex talks about what he’s learned from the most recent survey and its implications to the supply market in 2026 and beyond. No surprise, AI plays a remarkably large role in all the current trends.

Learning With Leo: The Disappearing Manufacturing Engineer

02/04/2026 | Leo Lambert -- Column: Learning With Leo
Manufacturing engineers are the firefighters of the manufacturing process, but as the industry changes the roles of the manufacturing engineer and manufacturing facilities export their manufacturing offshore, what happens to the function, viability, and knowledge of the manufacturing engineer? Where design engineering was known as a profession, manufacturing engineering was known as a job, not a career path. Although I was disappointed about that at the time, now I look back and wonder about the truth of that statement.

CELUS, Atlantik Elektronik Partner to Accelerate AI Hardware Design Revolution

01/22/2026 | BUSINESS WIRE
CELUS, developer of the leading AI-assisted electronics design platform used by developers and engineers globally, and Atlantik Elektronik, a leading distributor and design-in specialist for innovative electronic and semiconductor components, announced a strategic partnership aimed at streamlining and accelerating the hardware design process for engineers globally.

Powering the Future: The Materials That Make Tomorrow Possible

01/14/2026 | Brian Buyea -- Column: Powering the Future
At Remtec, we live in the intersection where science meets manufacturability, and where reliability isn’t a promise but a measurable outcome. “Powering the Future” isn’t just a slogan. It’s the challenge we face daily as engineers designing metallized ceramic substrates, power packages, and thermal solutions that quietly enable the technologies shaping our world.
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