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New Guide Offers In-Depth Look at Thermal Management in PCB Design
April 14, 2025 | I-Connect007Estimated reading time: Less than a minute

I-Connect007 is proud to release The Companion Guide to PCB Thermal Management, a must-have resource designed to complement NCAB’s popular podcast series. Created for engineers and PCB designers, this guide offers a comprehensive look at critical thermal management strategies essential for today's high-performance electronics.
As devices become more powerful and compact, effective heat management is no longer optional—it’s vital to maintaining long-term reliability and performance. This resource identifies primary heat sources on a PCB—such as active components, high-power currents, high-frequency signals, and external environmental conditions—and explains the potential risks of insufficient thermal control, including component degradation and system failure.
To address these challenges, this guide presents a range of proven heat dissipation techniques, including:
- Optimized layout and component placement
- Advanced thermal simulation tools
- Strategic material selection
- Copper thickness adjustments
- Use of thermal vias and insulated metal substrates (IMS)
- Implementation of cutting-edge copper coin technology
This companion guide empowers engineers to prevent costly redesigns and optimize PCB functionality by stressing the importance of integrating thermal considerations from the outset. It is an essential read for those designing durable, high-performance electronics.
Now available for download here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
IEEE Study Shows Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics
07/22/2025 | PRNewswireMulti-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size increases thermal crosstalk, which may affect laser efficiency and reliability.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Eco-Scouts Initiative: Rehm Apprentice Team Receives Jury Award
07/04/2025 | Rehm Thermal SystemsAt the end of May, as part of this year’s ECO-Scouts Initiative, 14 interdisciplinary apprentice teams from various companies presented their project results to a panel of experts.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.