Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
New Guide Offers In-Depth Look at Thermal Management in PCB Design
April 14, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is proud to release The Companion Guide to PCB Thermal Management, a must-have resource designed to complement NCAB’s popular podcast series. Created for engineers and PCB designers, this guide offers a comprehensive look at critical thermal management strategies essential for today's high-performance electronics.
As devices become more powerful and compact, effective heat management is no longer optional—it’s vital to maintaining long-term reliability and performance. This resource identifies primary heat sources on a PCB—such as active components, high-power currents, high-frequency signals, and external environmental conditions—and explains the potential risks of insufficient thermal control, including component degradation and system failure.
To address these challenges, this guide presents a range of proven heat dissipation techniques, including:
- Optimized layout and component placement
- Advanced thermal simulation tools
- Strategic material selection
- Copper thickness adjustments
- Use of thermal vias and insulated metal substrates (IMS)
- Implementation of cutting-edge copper coin technology
This companion guide empowers engineers to prevent costly redesigns and optimize PCB functionality by stressing the importance of integrating thermal considerations from the outset. It is an essential read for those designing durable, high-performance electronics.
Now available for download here.
Share on:
Suggested Items
2025 COMPUTEX Compal Unveils 'The Race is On' Strategy During Forum Session
05/23/2025 | Compal Electronics Inc.As AI models and computing density continue to grow at an exponential rate, the data center industry is entering a new era where cooling capacity has become the next competitive threshold.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.