Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Target Condition: Rethinking the PCB Stackup Recipe
Connect the Dots: Evolution of PCB Manufacturing—Lamination
New Guide Offers In-Depth Look at Thermal Management in PCB Design
April 14, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is proud to release The Companion Guide to PCB Thermal Management, a must-have resource designed to complement NCAB’s popular podcast series. Created for engineers and PCB designers, this guide offers a comprehensive look at critical thermal management strategies essential for today's high-performance electronics.
As devices become more powerful and compact, effective heat management is no longer optional—it’s vital to maintaining long-term reliability and performance. This resource identifies primary heat sources on a PCB—such as active components, high-power currents, high-frequency signals, and external environmental conditions—and explains the potential risks of insufficient thermal control, including component degradation and system failure.
To address these challenges, this guide presents a range of proven heat dissipation techniques, including:
- Optimized layout and component placement
- Advanced thermal simulation tools
- Strategic material selection
- Copper thickness adjustments
- Use of thermal vias and insulated metal substrates (IMS)
- Implementation of cutting-edge copper coin technology
This companion guide empowers engineers to prevent costly redesigns and optimize PCB functionality by stressing the importance of integrating thermal considerations from the outset. It is an essential read for those designing durable, high-performance electronics.
Now available for download here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Teledyne Labtech Leads Groundbreaking Welsh Space Cooling Project with Bangor University
09/25/2025 | BUSINESS WIRETeledyne Labtech, a leading innovator in advanced electronic PCB solutions is spearheading a pioneering Welsh disruptive technology that could revolutionize thermal management in space electronics.
Indium Experts to Present on Thermal Interface Materials at IMAPS Microelectronics Symposium
09/24/2025 | Indium CorporationIndium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.