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High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
May 20, 2024 | High Density Packaging User GroupEstimated reading time: 1 minute
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
"Our mission is always to become the most reliable printed circuit board manufacturer in the world. We are focused on innovation all the time with R&D investments of about 10% year over year. Kinwong has a highly advanced Central Lab that is ISO 17025 qualified and can be used as a 3rd party lab", said Vincent Wang, the Tech. R&D Director at Kinwong. “It’s really a great honor to join HDP and I strongly believe the interaction with the HDP community will provide insights to have better understanding of cutting-edge technologies. The one chain of upstream, middle-stream and downstream linked by HDP will give all of us the full picture of the industry and accelerate innovation.”
"I am pleased to welcome Kinwong to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on HDI for next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
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