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Elephantech Launches World’s Smallest-Class Copper Nanofiller
July 17, 2025 | ElephantechEstimated reading time: 1 minute
Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Synthesized using Elephantech’s proprietary technology developed over years of R&D, the newly released copper nanofiller consists of ultra-fine, uniformly produced particles averaging 15 nm in size. It exhibits exceptional dispersion stability for over 6 months. In addition to storage stability, the material also enables simplification of process by allowing low-temperature wet reduction at 60℃.
Supported by these specifications, the copper nanofiller offers excellent features, including high electrical conductivity, low resistivity, and thermal conductivity. Its flexibility across supply formats -from inks to pastes- enables a wide range of applications, such as:
Upon its debut, Elephantech has received significant inquiries and intentions about adopting this best-in-class material in their products and solutions. By elevating the performance standards in its category, the innovative copper nanofiller is poised to help more manufacturers unlock new potential.
Building on its extensive experience in printed circuit board (PCB) development and manufacturing solutions, Elephantech is now expanding the value of its nano-materials portfolio while maintaining its focus on the PCB sector. With a strong foundation in science innovation and a longstanding commitment to sustainability, the company continues to drive momentum to accelerate transformation across the electronics industry.
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Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
04/30/2025 | ElephantechJapanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing.
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.