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Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
September 18, 2025 | AismalibarEstimated reading time: 1 minute
Aismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
Featured Innovations
- COBRITHERM ALP – A thermally conductive/dielectric aluminum substrate combining high dielectric strength (up to 10 kV) with superior thermal conductivity (2.2–3.2 W/mK). Ideal for EV batteries, telecom, and high-voltage systems, it reduces assembly time and cost while supporting automated PCB assembly.
- THIN LAM – Thermal FR4 for Multilayer PCBs – Optimized for SiC and GaN devices, THIN LAM lowers device temperatures by ~20°C compared to standard FR4, delivers >7% higher power throughput, and eliminates the need for thermal vias, improving reliability and simplifying PCB design.
- AirGapFiller for better heat flow in Electronic Power Modules – A surface-adaptive coating that fills microscopic voids at just 35–40°C to improve thermal contact, reduce resistance, and enhance heat dissipation in electronic power modules.
- Bond Sheet Cured (Glass-Free) – A high-performance insulation and thermal transmission material offering dielectric strength up to 10 kV, thermal conductivity up to 3.2 W/mK, and ultra-low thermal resistance (as low as 0.031 K/W). Clean, flexible, and fiber-free, it ensures long-term stability in demanding EV and industrial applications.
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Rachael Temple - AlltematedSuggested Items
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
The Road to Reliability: Why EV Electronics Matter More Than Ever
09/16/2025 | Stanton Rak, SF Rak CompanyThe global transition to e-Mobility is redefining the design and reliability expectations of automotive electronics. Unlike their internal combustion engine (ICE) counterparts, EVs operate under "always-on" conditions and are subject to higher voltages, higher currents, and elevated thermal loads. These systems also incorporate exponentially more sensors, control units, and advanced power electronics, often tightly packed in thermally constrained spaces.
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.