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ESCATEC Installs Third Wave Soldering Machine in Penang to Meet Growing Demand
November 14, 2025 | ESCATECEstimated reading time: 1 minute
Electronics manufacturing services (EMS) provider ESCATEC’s business unit in Penang, ESCATEC Electronics Sdn Bhd (EEM), recently welcomed the installation of an advanced Ersa POWERFLOW ULTRA wave soldering system, strengthening its capabilities and production capacity for customers bringing complex high-tech products to market.
The new equipment underwent several weeks of engineering evaluation and testing at the site and has now been put into production, making it the third wave soldering system currently operational at EEM.
The investment enhances EEM’s ability to meet increasing customer demand for advanced and high-quality services capable of integrating emerging technologies into products. It also reflects the broader direction underway at all ESCATEC business units globally toward increased automation, digital integration, and smart manufacturing, across all facilities.
For reference, the POWERFLOW ULTRA is a full-tunnel, lead-free wave soldering system designed for high flexibility and throughput. Its features include a modular preheating section of up to five convection and infrared zones, dual-wave soldering technology for precise process control, and a nitrogen-controlled environment to ensure consistent solder quality. The system supports PCB widths up to 610 mm and operates on Ersa’s latest ERSASOFT 5 platform, which enables automated operation, continuous process monitoring, and data integration, with ESCATEC’s manufacturing system.
"To provide a high level of service to customers and to strengthen existing partnerships, ESCATEC will continue to focus on acquiring the highest level of technology that is also agile and can be integrated with our existing digital systems, in order to provide full real-time control and traceability,” said ESCATEC COO, Alessandro Marinai.
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12/09/2025 | Nolan Johnson, SMT007 MagazineAn ever-widening variety of components and denser board features are creating a gap for new equipment. Just as stencils are moving to multi-thickness panels for complex applications, soldering hardware is evolving to become more precise and integrated into the entire manufacturing line. Jeanine Norlin and Roberta Foster-Smith, representatives of Nordson Electronics Solutions, discuss the current state and implications of selective soldering, including a case study of a customer that made a change. How will selective soldering fit into your future?
Nolan’s Notes: A Tribute to Iola—and Automation
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Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.
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