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Northrop Grumman Awarded Contracting Tool to Speed Military Microelectronics
February 3, 2026 | Northrop GrummanEstimated reading time: 1 minute
Northrop Grumman is one of the companies selected to receive an award from the Defense Microelectronics Activity (DMEA) for a contracting resource. This tool has an award ceiling of $25 billion and can speed up the delivery of military-grade semiconductor technology to get solutions into the hands of warfighters faster.
Under the Advanced Technology Support Program V (ATSP5), Northrop Grumman can:
- Respond to Requests for Proposals within 30 days. The ATSP5 enables an 80 to 90-day turnaround time from proposal to award.
- Continue to advance solutions in next-generation manufacturing and packaging techniques as well as emerging semiconductor materials engineering.
Expert:
Lori Manley, program manager, ATSP5, Northrop Grumman: “The government demands swift action, and we’re ready to deliver speed with this solution. After years of using this process to complete more than 200 task orders across Northrop Grumman, the award of the ATSP5 contract proves our ability to rapidly integrate American-made microelectronics solutions and strengthen the U.S supply chain by ensuring speedy deployment of reliable systems for the warfighters who need them.”
Details on Program:
ATSP5 is an ‘Indefinite Delivery, Indefinite Quantity’ (IDIQ) contract used to ensure military systems have access to the most advanced microelectronics embedded within, replacing chips that are generations behind those available from commercial companies to deliver weapons systems readiness.
Aligned with the Secretary of War’s priorities, this award will enable improved responsiveness, defines both short and long-term goals, ensuring that teams remain focused on delivering solutions with speed to supercharge those providing technology to U.S. military.
Northrop Grumman designs, manufactures, assembles, tests and packages millions of microelectronics annually to support next-generation defense and commercial systems in the United States, ensuring the American supply chain is protected and sustainable to strengthen national defense infrastructure. From design, fabrication, to field, the company’s mission-tailored microelectronics serve as the crucial intelligence powering next-generation military and commercial systems and are foundational to mission success.
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Julia McCaffrey - NCAB GroupSuggested Items
Ensuring the Next Generation of U.S. Weapons Has Homegrown Electronics
03/31/2026 | David Schild, PCBAAThe U.S. has in the works several new weapons to counter emerging enemy threats. These include new warships, fighter aircraft, bombers, submarines, drones and a network of air defenses to defend the entire U.S. against missile and air attacks. And yet the U.S. will be challenged to produce key electronics within these systems known as printed circuit boards (PCBs), which are primarily sourced domestically. While the U.S. government has played a key role in helping to revive the domestic semiconductor industry, with the exception of some funding through the Defense Product Act it has largely ignored domestic production of PCBs.
STMicroelectronics Advances Ultra-Wideband for Automotive and Smart Devices
03/13/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an ultra-wideband (UWB) chip family that comprehensively supports the next-generation wireless standard for localizing and tracking devices at distances up to several hundred meters.
Saab, Kyiv School of Economics Launch Strategic Collaboration in Critical Defence Technologies
03/09/2026 | SaabSaab and Kyiv School of Economics have signed a collaboration agreement to strengthen research and development in unmanned aerial systems (UAVs) and microelectronics — two technology areas that are increasingly critical to modern defence and security capabilities.
STMicroelectronics Expands Silicon Photonics Production for AI Demand
03/09/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.
Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging
03/06/2026 | Kurtz Ersa Corp.Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.