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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 6, 2026 | Michelle Te, I-Connect007Estimated reading time: 3 minutes
As a longtime writer and editor, I’m very intrigued by different writing styles, from straightforward news to technical, persuasive, and narrative styles of writing. They all have their place in how and what we want to communicate. How do I want the reader to feel? What action do I want them to take? The “power of the pen” is quite fascinating! As you review my must-reads for the week, I encourage you to pay attention to how they are written and why that style might resonate with you.
I’m highlighting a book, a podcast, a magazine, winners of the APEX EXPO Technical Conference, and a narrative-style column. Not only do these published pieces vary in style, but they also examine the electronics industry from a variety of perspectives. From test to materials, trade show storytelling, and thought leadership, I-Connect007 has the industry covered.
In that vein, please watch the final two pre-show interviews with our premium sponsors, Technica USA and Blackfox, who are speaking about what they’ll be offering at APEX EXPO this year.
Best Technical Paper Awards Showcased at APEX EXPO 2026
Published March 2
There’s a lot of facts and opinions floating around out there these days, so it’s comforting to stay grounded in topics like those coming from the winners of the APEX EXPO 2026 Advanced Electronic Packaging Conference. Matt Kelly, CTO of the Global Electronics Association, said these recipients “delivered research that advances fundamental understanding, while also providing practical guidance for improving reliability, performance, and manufacturing excellence in electronics.” Follow this link to find out what your peers are working on.
SMT007 Magazine: Europe’s Future in Electronics
Published March 3
We’re marching our way around the globe, this time stopping to survey the electronics ecosystem in Europe in the latest issue of SMT007 Magazine. It’s no secret that Europe has struggled to maintain an edge in today’s supply chain. We focus on what’s happened and where Europe is headed, from interviews with companies forming strategic partnerships and bringing fresh ideas, to how the Global Electronics Association is advocating on behalf of the industry with the European Commission. There’s some good news to share, so be sure to check out this issue.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
Published March 4
As electronics become denser and more complex, test strategy has to move from an afterthought to part of the design conversation. In his new book, The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection, Bert Horner, president of The Test Connection and a longtime advocate for better test practices, shares his decades of real-world experience to help engineers build smarter, more reliable products from the start. It’s just the latest in our growing collection of books tailored to specific topics in the electronics industry. (Have you downloaded your copy of Brian Chislea’s new book, The Printed Circuit Designer’s Guide to… UV Curable Conformal Coatings?)
Elementary, Mr. Watson: APEX EXPO—The Ghosts of Past, Present, and Future
Published March 5
I really loved John Watson’s creative storytelling approach to APEX EXPO (and which could apply to any trade show for that matter). John’s columns are always filled with fun stories about food and grandchildren, but this time, he put his focus squarely on how an engineer might feel about taking several days away from their busy schedules to attend the show. He makes his case, and I know you’ll feel that by the time the “ghost” brings the engineer back to the present.
AI Is Changing the Rules: Are Your PCB Materials Ready?
Published March 5
Episode 2 of of our six-part podcast on the critical role of materials in PCB fabrication just dropped. The series is designed to help engineers, fabricators, and decision-makers better understand the fundamentals that most directly impact manufacturing outcomes, says podcast host and I-Connect007 Executive Director Marcy LaRont. In this episode, she talks with Isola’s Drew Delaney to get a firsthand look at how materials science is quietly powering everything from hyperscale AI data centers to 5G antennas and rugged edge devices. Start your journey into PCB materials here and check back each week for a new episode.
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Rachael Temple - AlltematedSuggested Items
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.