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Henger Targets AI PCB Challenges With Advanced Plasma Technology

04/02/2026 | I-Connect007 Editorial Team
Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.

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Next week, Chemcut will be exhibiting at APEX EXPO, taking place March 17–19, 2026 at the Anaheim Convention Center in Anaheim, California.

Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging

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Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.

Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production

03/02/2026 | Kurt Palmer -- Column: Driving Innovation
In high-end electronics, complexity is often measured in microns. However, when those microns are spread across a massive surface area, the engineering challenge fundamentally changes. Imagine two panels: Both are highly complex, featuring 4-stage build-ups, 2-mil line and space patterns, 2-mil microvias, and through-holes with a demanding 1:30 aspect ratio.
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