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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Texas Instruments Expands Microcontroller Portfolio to Enable Edge AI in Every Device
March 13, 2026 | Texas InstrumentsEstimated reading time: 1 minute
Texas Instruments (TI) introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate TI's TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimizes deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge.
TI's embedded processing portfolio is supported by a comprehensive development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with TI data. Altogether, TI is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. These end-to-end innovations are featured in TI's booth at embedded world 2026, March 10-12, in Nuremberg, Germany.
"TI invented the digital signal processor almost 50 years ago, laying the groundwork for today's edge AI processing," said Amichai Ron, senior vice president, Embedded Processing and DLP® Products at TI. "Now TI is leading the next phase of innovation by integrating the TinyEngine NPU across our entire microcontroller portfolio, including general-purpose and high-performance, real-time MCUs. By enabling AI across our software, tools, devices and ecosystem, we are making edge AI accessible and easy to use for every customer and every application."
"While much of the world has been focused on AI acceleration and NPUs in bigger SoCs, it turns out some of the more interesting and far-reaching applications of AI can be enabled inside smaller chips like microcontrollers," said Bob O'Donnell, President and Chief Analyst at TECHnalysis Research. "Edge-based applications of AI acceleration can make consumer devices more intelligent and industrial devices more efficient. Plus, if you can combine these chips with software development tools that themselves leverage AI to help build AI features, you bring the power of AI acceleration to a significantly wider audience of engineers and device designers."
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Rachael Temple - AlltematedSuggested Items
Henger Targets AI PCB Challenges With Advanced Plasma Technology
04/02/2026 | I-Connect007 Editorial TeamHenger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
Leonardo DRS Introduces THOR, Delivering Decisive Edge Computing Power to the Modern Battlefield
03/25/2026 | BUSINESS WIRELeonardo DRS, Inc. announced the introduction of THOR - Tactical, High-Performance Embedded Computing, Open Architecture, Rugged - a rugged, open-architecture 3U VPX embedded computing chassis purpose-built to deliver high-performance processing at the tactical edge.
Chemcut at APEX EXPO 2026: Innovations & Opportunities
03/11/2026 | Chemcut CorporationNext week, Chemcut will be exhibiting at APEX EXPO, taking place March 17–19, 2026 at the Anaheim Convention Center in Anaheim, California.
Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging
03/06/2026 | Kurtz Ersa Corp.Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.
Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production
03/02/2026 | Kurt Palmer -- Column: Driving InnovationIn high-end electronics, complexity is often measured in microns. However, when those microns are spread across a massive surface area, the engineering challenge fundamentally changes. Imagine two panels: Both are highly complex, featuring 4-stage build-ups, 2-mil line and space patterns, 2-mil microvias, and through-holes with a demanding 1:30 aspect ratio.