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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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1H Performance of Global PCB Industry
Headlines of the Week
(Please contact haverhill@dknreseach.com for further information on the news.)
1. Sumitomo Electric (Major cable manufacturer in Japan) 8/7
The manufacturer has developed an ultra-small wireless power supply module for wearable devices, replacing wired coils with flexible circuits. Thickness: 0.25 mm.
2. Mitsubishi Heavy Industry (Major manufacturer in Japan) 8/11
The manufacturer has begun a room-temperature wafer bonding service for 3D devices such as MEMS and biosensors. It covers various wafers other than silicon.
3. OKI Group (Major electronics company in Japan) 8/18
The company has commercialized a new large scale screen mask washer capable up to 1,400 mm square for the manufacturing process of FPDs, touch screens, PWBs, etc.
4. Fujitsu Group (Major electronics company in Japan) 8/18
The company will begin operations at the Akisai Vegetable Plant, a 100% closed agriculture pilot plant in Aizuwakamatsu.
5. KOMORI (Equipment manufacturer in Japan) 8/22
The manufacturer has unveiled a new high-resolution gravure offset printer for the manufacturing process of touch panel screens. It is capable of 30 micron L/S and 5 micron mesh.
6. Toshiba (Major electric & electronics company in Japan) 8/22
The company has began the pilot plant operation of a binary generation system consisting of wind power, solar energy, and biomass.
7. ASE (Major packaging firm in Taiwan) 8/26
The firm has agreed to co-develop new MEMS devices with Bosch using wafer level packaging. They have already developed the world's smallest acceleration sensor.
8. Tohoku University (Japan) 8/26
The university has co-developed a new all solid state lithium-sulfur secondary battery with Mitsubishi Gas Chemical. The battery will have extremely high energy density.
9. Tokyo University (Japan) 8/27
The university has developed a pure organic material that changes electric conductivity and magnetism at the same time. The material could generate new switching devices.
10. TDK (Major device supplier in Japan) 8/26
The supplier has developed a new reliable Piezo actuator with 75% electric/mechanical coupling coefficients for automobile applications. It works in high temperature up to 170°C.
11. Mitsubishi Material (Major material supplier in Japan) 8/27
The supplier has developed a new fluorine recycling process for electrolytic solutions of lithium ion batteries.
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