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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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EPTE Newsletter
Column from: Dominique Numakura
The EPTE Newsletter from Japan ran from 2014–2021 and was brought to you by Dominique Numakura, the founder and managing director of DKN Research. Prior to this column, he worked for circuit board businesses and packaging material businesses more than 25 years. Dominique developed many advanced technologies in high-density substrates and materials over the last decade. He wrote over 100 articles for major conferences and magazines, and he is the author of several books on electronic packaging technologies. He earned his master's degree in physical chemistry and nuclear chemistry from Ibaraki University, Japan.