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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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EPTE Newsletter
Column from: Dominique Numakura
The EPTE Newsletter from Japan ran from 2014–2021 and was brought to you by Dominique Numakura, the founder and managing director of DKN Research. Prior to this column, he worked for circuit board businesses and packaging material businesses more than 25 years. Dominique developed many advanced technologies in high-density substrates and materials over the last decade. He wrote over 100 articles for major conferences and magazines, and he is the author of several books on electronic packaging technologies. He earned his master's degree in physical chemistry and nuclear chemistry from Ibaraki University, Japan.