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When "Made in USA" Means Trouble

Headlines of the Week

(Please contact haverhill@dknreseach.com for further information of the news.)

1. NGK (Major ceramic product manufacturer) 7/11
The manufacturer will expand manufacturing capacity of NOx sensor device 50% to 10 million units per year to satisfy growing demands in automobile applications.

2. Kyoto University (Japan) 7/11
The university has developed a new metallic magnesium-based secondary battery with increased energy density, improved safety, and at a lower cost than a lithium ion battery.

3. Sumitomo Corp. (Major trading company in Japan) 7/14
The company plans to build a new biomass power generation plant with 75 MW capacity in Aichi Prefecture. Commercial operation will begin in 2016.

4. Tohoku University (Japan) 7/14
The university has co-developed a new porous silicon powder with an open cell structure as the anode material with a large relative surface.

5. FDK (Major device manufacturer in Japan) 7/15
The manufacturer has developed a new tiny power inductor, “MIPSKZ1608G,” (1.6 x 0.8 x 0.3 mm) with an LGA package for wearable and mobile devices.

6. J Touch (Major touch screen manufacturer in Taiwan) 7/19
The manufacturer will begin the volume supply of a metal mesh-type touch screen to Japanese customers in the fourth quarter. The company invested NT $1 billion for the manufacturing line last year.

7. FDK (Major device manufacturer in Japan) 7/22
The manufacturer has commercialized the smallest insulation type DC/DC power module “KD Series” for both of SMT and TH mounting. 34.28 x 22.8 x 8.5 mm.

8. University (Japan) 7/22
The university has co-developed a new nano-granular film material with giant dielectric and magneto-electric responses at room temperature.

9. Furukawa Electric (Major cable manufacturer in Japan) 7/25
The manufacturer has developed a new tin plating process, “Anchor Fou,r” for the lead frame soldering process as an alternative solution to gold plating. It has a longer life in avoiding surface oxidation.

10. TANAKA Holdings (Specialty metal product supplier) 7/29
The supplier will provide MEMS CORE, a patterning technology with sub-micron gold powder. MEMS CORE will subcontract the packaging for MEMS manufacturers.

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