Estimated reading time: 3 minutes

Slow Start for PCB Industry

Headlines of the Week

(Please contact haverhill@dknreseach.com for further information on the news.)

1. JAIST (Technical institute in Japan) 3/23
The institute has developed a new design procedure for fuel cell materials that provides higher efficiency and lower cost.

2. Mitsubishi Chemical (Major chemical company in Japan) 3/24
The company has developed the world's first large-scale wall-setting solar generator unit with organic thin film photovoltaic cells for Zero Energy Building.

3. Panasonic (Major electronics company in Japan) 3/25
The company has developed a new solar power generation package, “Power Supplier Container,” for developing countries.

4. Toyota Motors (Major automobile company in Japan) 3/25
The company has co-developed the world's first “Car-to-Car" recycling system for copper metals of wire harness.

5. Nikon (Major optical product supplier in Japan) 3/25
The supplier has commercialized a new Rayfact lens with 90-mm diameter image circle for PCB and FPD inspection equipment.

6. NGK Insulators (Major ceramic product supplier in Japan) 3/27
The supplier has decided to commercialize bonded hybrid wafers for SAW filters and wavelength conversion elements for green lasers.

7. Toshiba (Major electric & electronic company in Japan) 3/27
The company has unveiled the smallest CSP package for white light LEDs with 130 lm/W. Package size: 0.65 mm x 0.65 mm.

8. Mitsubishi Materials (Major material supplier in Japan) 3/28
The supplier has developed a new, high-performance direct bonded aluminum (DBA) substrate with a baked silver coating for HV automobiles power modules.

9. TEL (Major semiconductor equipment supplier in Japan) 3/28
The supplier has created an inkjet printer business co-developed with Seiko Epson, for manufacturing OLEDs.

10. Panasonic (Major electronics company in Japan) 4/1
The company has rolled out the smallest pitch flex circuit connector series (0.35 mm pitch) for wearable devices and portable devices.

11.  ASE (Major packaging firm in Taiwan) 4/3
The firm will found a new JV for TSV 3D IC packaging with Inotera Memories. Initial capacity will be 10k units/month.

Recent Articles from DKN Research

To view full articles, click here.

• < Previous Page