-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 4 minutes
New Champ of the PCB Industry
Headlines of the Week
(Please contact haverhill@dknreseach.com for further information on the news.)
1. JAIST (Technical institute in Japan) 2/14
The organization has developed the world's most heat resistant plastic with high transparency through a bio-chemical process. It withstands temperatures of up to 390 degrees C.
2. USHIO (Major lighting equipment supplier in Japan) 2/17
The supplier has developed the world's first parallel VUV light source unit for high-resolution direct imaging equipment used with flexible electronics.
3. Yamagata University (Japan) 2/18
The university has co-developed the world's first flexible organic semiconductor via a printing process with Ube Industries.
4. NEC SCHOTT Components (Device manufacturer in Japan) 2/25
The manufacturer has unveiled a new packaging technology, “GTAS,” for lithium ion batteries.
5. Hitachi Chemical (Major electronics material supplier in Japan) 3/3
The supplier has created a new joint venture for epoxy resin molding with Hitachi and Sumitomo Electric.
6. Konica Minolta (Major optical device manufacturer in Japan) 3/4
The manufacturer has developed a white organic EL lighting panel featuring the world's highest efficiency of 131 lm/W.
7. Kyocera (Major electronics company in Japan) 3/3
The company has commercialized a new 0.5-mm pitch ZIF FFC connector 6808 Series capable for use with power lines of high-density flex circuits.
8. AIST (R&D organization in Japan) 3/4
The organization has co-developed a mono-layer carbon nanotube via a printing process. It could be valuable as an electrode material of various batteries.
9. SPIL (Major packaging firm in Taiwan) 3/5
February shipments of NT $5.574 billion declined 7.5% from the previous month, but increased 31.1% from the same month of the previous year.
10. Mitsubishi Materials (Major material supplier in Japan) 3/10
The supplier has developed the world's thinnest bendable thermistor sensor built on 50 micron thick polyimide film. Total thickness can be thinner than 70 microns.
11. MURATA (Major device manufacturer in Japan) 3/11
The manufacturer has developed the world's first SMT-type ultrasound sensor for mobile applications. Size: 5.2 x 5.2 x 1.15 mm; sensitivity: 100dB.
Recent Articles from DKN Research
To view full articles from DKN, click here.
Page 2 of 2More Columns from EPTE Newsletter
EPTE Newsletter: Travel to Japan During COVIDEPTE Newsletter: A New COVID Surge in Taiwan?
EPTE Newsletter: COVID-19 PCR Test in Japan
EPTE Newsletter: Japan Failing in Vaccine Distribution
EPTE Newsletter: A Long Trip to the U.S.
EPTE Newsletter: Ten Years After Fukushima
EPTE Newsletter: Taiwan Releases 2020 PCB Production Numbers
EPTE Newsletter: The Printed Circuit Industry in China