-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Estimated reading time: 1 minute

The Do’s and Don’ts of Signal Routing for Controlled Impedance
In this column, we will once again be focusing on controlled impedance structures, both from the layout side and the simulation side. I will break them down into the sub-categories of the models they represent and the important points to remember when using the various models. I will also be asking questions such as, “Why would a fabricator ask for a larger impedance tolerance?” and “Where does the fabricator draw the line for controlling various structures?”
Later, I will break down my Top 10 do’s and don’ts of signal routing.
A Few Rules of Thumb
Let’s start with single-ended structures, both co-planar and those in “free space,” i.e., not coupled to any adjacent copper pour.
For external single-ended structures starting with quarter or half-ounce copper, the trace width is typically about twice the dielectric needed between the impedance signal and its reference plane.
Example: A 4.25 mil trace needs about a .0026”–.0028” dielectric to be a reference plane for 50 ohms on half-ounce starting copper (1.5 ounces after plating).
Keep the copper pour that resides on the impedance layer a minimum of 3x the chosen trace width for impedance; this ensures no unwanted co-planar coupling occurs. At larger trace widths upwards of .012” this distance can be as little as 2x the trace width.
To read this column by Mark Thompson which appeared in the May 2015 issue of The PCB Design Magazine, click here.
More Columns from The Bare (Board) Truth
The Bare (Board) Truth: My Top Six Design ChallengesThe Bare (Board) Truth: Via Basics
The Bare (Board) Truth: 5 Questions About Improving Thermal Management
The Bare (Board) Truth: Teaching the Next Generation—An Overview of Today’s University Courses
The Bare (Board) Truth: Fabrication Starts With Solid Design Practices
Board Negotiations: Design Rules and Tolerances
The Bare (Board) Truth: Eliminate Confusion
The Bare (Board) Truth: Getting on the Same Page—A Data Story