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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Estimated reading time: 12 minutes

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More Columns from Happy’s Tech Talk
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole VoidsHappy’s Tech Talk #39: PCBs Replace Motor Windings
Happy’s Tech Talk #38: Novel Metallization for UHDI
Happy’s Tech Talk #37: New Ultra HDI Materials
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Happy’s Tech Talk #35: Yields March to Design Rules
Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics
Happy’s Tech Talk #33: Wet Process Management and Control