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DownStream: Smoothing out the Post-Processing Bumps
March 18, 2020 | Real Time with...IPCEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/8816/3155/0232/joe_clark_300.jpg)
During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview from the show, Joe Clark, co-founder of DownStream Technologies, gives Guest Editor Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26?28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
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Opportunity Knocks
09/04/2024 | Michelle Te, IPC CommunityIPC member DETEX Corporation of New Braunfels, Texas, like so many similar companies, strives to cultivate a highly skilled workforce to meet the growing demand for electronics assembly professionals. But also like many companies, DETEX, which engineers and manufactures security products, has struggled to hire qualified workers. Most employees are hired without certification or experience. Providing on-the-job training (OJT) without technical instruction has been met with limited success.
TRI’s High-Performance Inspection Solutions at SMTAI 2024
08/27/2024 | TRITest Research, Inc. (TRI) is joining the upcoming SMTA International Exposition & Conference on October 22 – 24, 2024, at the Donald E. Stephens Convention Center, Rosemont, IL, USA.
Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.