Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization

07/16/2024 | Michael Carano -- Column: Trouble in Your Tank
Laminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.

Beyond Prepreg: The Glassless ‘Revolution’

06/25/2024 | Marcy LaRont, PCB007 Magazine
As our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.

Connect the Dots: Designing for Reality—Lamination and Materials

06/19/2024 | Matt Stevenson -- Column: Connect the Dots
As many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.

Day 2: A Full Day at the EIPC Summer Conference

06/19/2024 | Pete Starkey, I-Connect007
Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion. 

Looking Into Space: EIPC Summer Conference, Part 2

06/17/2024 | Pete Starkey, I-Connect007
“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in