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I-Connect007 Editor’s Picks: Five Must-Reads for the Week
June 10, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
![](https://iconnect007.com/application/files/1917/2542/9909/Nolan_Johnson_300.jpg)
PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.
Mike Carano Joins the Averatek Team as Vice President of Quality
Published June 3
As a former VI at RBP Chemical Technology, and Global R&D director at OM Group, as well as an influential advisor for IPC, I-Connect007 columnist Mike Carano brings a deep skillset to this new role with Averatek. Read the details here.
The Double-edged Sword of CMMC 2.0
Published June 6
MX2 Technology’s Divyash Patel updates readers on CMMC (Cybersecurity Maturity Model Certification) overall, and the upcoming version 2.0 criteria specifically. Given the likelihood that CMMC will touch most of us in the industry eventually, readers clearly wanted to know more.
Atotech Sells 1,000th Horizontal Electrolytic Copper Plater
Published June 8
Atotech announced the sale of its 1,000th installation of the Uniplate horizontal plating line to a Taiwan-based PCB manufacturer. The article also includes a timeline of milestones in the Uniplate line.
Isola Lays Groundwork for Faster, Higher-Frequency Circuits at 2022 IMS
Published June 7
If you’re visiting the 2022 IEEE International Microwave Symposium in Denver, Colorado, June 21-23, Isola will be present, discussing hybrid design and fabrication and dielectric constants in materials. Readership was high for this article; find the details inside.
Candor Nails the ROI With InduBond
Published June 7
Sunny Patel is engineering manager at Candor Industries. We follow up on Sunny Patel’s initial interview about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.
Suggested Items
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
Victory Announces Breakthrough in PCB Technology with New Product Launch
08/29/2024 | openPRShenzhen Victory Electronics Technology Co., Ltd., a leader in the printed circuit board (PCB) manufacturing industry, is proud to announce the successful development of a groundbreaking new product.
Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.
Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.