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My Experience With MaxwellNovember 23, 2022 | Happy Holden, I-Connect007
Estimated reading time: Less than a minute
I was first introduced to James Maxwell in 1967 as a college student. I had to decide whether I would take the Maxwell fields course or the switching and coding course. Being a chemical engineering major with a co-major in control theory, I had heard about the trials and tribulations of the infamous Maxwell fields course.
After a lot of consideration, I decided to take the switching and coding course, since it was more related to computer theory, while the fields course was more related to RF, power generation/distribution, and communications.
In those days, our transistors, tubes and ICs were still pretty slow, except for radio, radar, etc. At that time, signal integrity in board layout was not an issue. I was using RTL, DTL and slow TTL logic on breadboards of non-plated through-holes with tinned-copper wire and Teflon spaghetti tubing.
But after talking with students who had managed to successfully pass the fields course, I was awed by the mathematical rigors they had endured. I was astounded when these very same students found thermodynamics so difficult. Maxwell’s eqations are not easy.
To read this entire article, which appeared in the November issue of Design007 Magazine, click here.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.