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Current IssueRigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
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This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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Don't Blink: The IPC APEX EXPO Time-lapse
January 31, 2023 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute

It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.
The time-lapse location has varied over the years. This year’s time-lapse comes to you from the I-Connect007 booth, directly above the video studios, on the main aisle of the show. This vantage point illustrates just how vibrant the hall was over the course of the three-day exhibition.
We hope you enjoy this two-minute peek into a week as an exhibitor at IPC APEX EXPO 2023. And we’ll see you next April in Anaheim.
Suggested Items
The End of Solder?
09/28/2023 | Nolan Johnson, I-Connect007The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
IPC Unveils New Training Courses and Subscription Model for the Electronics Workforce
09/28/2023 | IPCIPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs.
IPC: Product Demand Weakens This Month, Though Operations Remain Generally Healthy
09/28/2023 | IPCThough product demand weakened this month with Orders and Backlog Indexes slipping, overall electronics industry operations remain healthy per IPC’s September 2023 Global Sentiment of the Electronics Supply Chain Report.
Rigid-flex Design Guidelines
09/27/2023 | Cherie Litson, CID+, Litson1 ConsultingRigid-flex circuits are unique structures; part rigid board and part flex, they’re increasingly working their way into many of the electronic devices we use every day. There have been many advances in rigid-flex lately as more companies find themselves exploring this technology. So, before I started writing this article about rigid-flex design, I double-checked a few things. Fortunately, there is plenty of rigid-flex information available on a variety of great websites that we all know and trust.
IPC Day France: Aerospace Electronics
09/18/2023 | IPCIPC Day France: Aerospace Electronics is an aerospace-focused networking event featuring key industry experts from NASA and Airbus and will take place on October 2, 2023 .