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Dream Chip, Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

06/19/2024 | Cadence Design Systems, Inc.
At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification solution and full-flow digital implementation, including signoff.

Cadence, Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

06/13/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes.

Cadence Completes Acquisition of BETA CAE

06/03/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced it has completed its previously announced acquisition of BETA CAE Systems International AG, a leading provider of multi-domain, engineering simulation solutions.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/03/2024 | Nolan Johnson, I-Connect007
This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.

Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design

04/25/2024 | Cadence Design Systems
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
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