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Cadence Partners with GSME to Further Semiconductor Industry Growth in Oman

06/28/2024 | Cadence Design Systems, Inc.
The global semiconductor supply chain is undergoing a profound transformation driven by several disruptive factors.

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

06/26/2024 | Cadence Design Systems, Inc.
The Cadence Janus NoC manages these simultaneous high-speed communications efficiently with minimal latency, enabling customers to achieve their PPA targets faster and with lower risk.

Cadence, Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era

06/25/2024 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry.

Dream Chip, Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

06/19/2024 | Cadence Design Systems, Inc.
At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification solution and full-flow digital implementation, including signoff.

Cadence, Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

06/13/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. Cadence Design Systems, Inc. announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes.
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