-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
T-Tech Releases IsoPro 3.2
September 16, 2015 | T-TechEstimated reading time: 1 minute
T-Tech, the manufacturer of the Quick Circuit line of rapid prototyping systems, has released IsoPro 3.2 software. This is the first major software release this year.
From user feedback our customers asked for an Isolation program which could produce Isolation data in G-Code format. IsoPro 3.2 provides these services allowing a company the opportunity to manufacture printed circuit boards on the Quick Circuit, in house, within an hour from the time the schematic and layout are completed.
The Contact-by-Touch software feature for the Quick Circuit QCJ5 is new and improved. You can now calibrate the depth of cut with the tool touching off the surface of the material in an average of five seconds from the time the tool has changed. This kind of precision calibration has never been achievable on a rapid prototyping machine before.
The real-time milling progress within IsoPro 3.2 is greatly enhanced. This allows the operator to automatically align multilayer PCBs in their lab. From over 10,000 customer installations in over 78 countries, scientists, electrical engineers and technicians now have an improved capability to produce prototype circuit boards in an environmentally friendly fashion.
For more information about IsoPro 3.2, contact sales@t-tech.com or call 800-370-1530.
You can also learn more about IsoPro 3.2 at PCB West in the Santa Clara Convention Center in Santa Clara, California. T-Tech is located in booth #500.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Flexible Circuit Technologies Welcomes Regional Business Development Manager Ryan Walsh
11/11/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Ryan Walsh as Regional Business Development Manager.
U.S. PCB Market Projected to Grow to $34.2 Billion by 2033
11/11/2025 | Globe NewswireThe United States printed circuit board market is expected to reach $34.2 billion by 2033 from $23.58 billion in 2024, with a CAGR of 4.22% from 2025 to 2033.
SCHMID Group Secures Major Orders for PLP and mSAP Production Equipment
11/11/2025 | SCHMID GroupSCHMID Group, a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, announced the successful acquisition of two significant orders in the fast-growing field of Panel Level Packaging and mSAP production equipment.
Green Circuits Appoints Kaitlyn Muhlenforth as Marketing Manager
11/05/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is excited to announce the appointment of Kaitlyn Muhlenforth as its new Marketing Manager.
Ventec to Exhibit Latest Materials and Machinery for Cutting-edge PCB Production at productronica 2025
11/05/2025 | Ventec International GroupVentec International Group will present advanced materials at Productronica 2025 in Munich, ushering in the ‘Glass Free Revolution’ with the latest and pro-bond & thermal-bond bondply materials.