-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
T-Tech Releases IsoPro 3.2
September 16, 2015 | T-TechEstimated reading time: 1 minute

T-Tech, the manufacturer of the Quick Circuit line of rapid prototyping systems, has released IsoPro 3.2 software. This is the first major software release this year.
From user feedback our customers asked for an Isolation program which could produce Isolation data in G-Code format. IsoPro 3.2 provides these services allowing a company the opportunity to manufacture printed circuit boards on the Quick Circuit, in house, within an hour from the time the schematic and layout are completed.
The Contact-by-Touch software feature for the Quick Circuit QCJ5 is new and improved. You can now calibrate the depth of cut with the tool touching off the surface of the material in an average of five seconds from the time the tool has changed. This kind of precision calibration has never been achievable on a rapid prototyping machine before.
The real-time milling progress within IsoPro 3.2 is greatly enhanced. This allows the operator to automatically align multilayer PCBs in their lab. From over 10,000 customer installations in over 78 countries, scientists, electrical engineers and technicians now have an improved capability to produce prototype circuit boards in an environmentally friendly fashion.
For more information about IsoPro 3.2, contact sales@t-tech.com or call 800-370-1530.
You can also learn more about IsoPro 3.2 at PCB West in the Santa Clara Convention Center in Santa Clara, California. T-Tech is located in booth #500.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.