Dan’s Biz Bookshelf: ‘In Defense of a Liberal Education’
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
Latest Articles
HDPUG and High-Frequency Test Methodologies
CEO Brian Butler talks with Guest Editor Bob Neves about the HDP User Group, an industry consortium that is developing test methodologies and programs. Brian decribes three of the current subcommittees: Material Characterization; Back Drill, having to do with defect detection and reliability; and Copper Surface Roughness.
Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process
Microfill through-hole fill electrolytic copper is a new process designed to offer outstanding through-hole fill, particularly for substrates intended for use as core layers in build–up applications, producing planar, solid copper plugs in high-volume production plating equipment. This article describes a novel copper through-hole fill electroplating process designed for use with insoluble anodes and direct current (DC) rectification.
The Flex-to-Fit Approach
The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularly shaped structure.
Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating
One of the three most fundamental aspects of printed circuit fabrication is the metallization and electroplating of throughhole vias and blind via interconnections. In this article, Michael Carano writes about the strategies in optimizing acid copper electrodeposition processes for high-throwing power DC plating.
ENEPIG: The Plating Process
In this article, George Milad talks about the complexity of the ENEPIG process, how it works, its requirements and the critical parameters that must be maintained in the ENEPIG line. He writes that shops that have good engineering and documentation of the manufacturing process, coupled with a dedicated, experienced ENEPIG operator that is backed by a capable analytical laboratory, run defect-free ENEPIG day in and day out.
Precision Back-drilling High-Speed PCBs? No Problem!
Grant Christiansen of Schmoll Maschinen discusses the latest developments for high-speed back-drilling, particularly for the North American market. He stresses the importance of both software and machine capability, along with working closely with the customer.
Polar Talks Impedance and Insertion Loss Testing
Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about controlled impedance and insertion loss testing.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
Flexible Circuits and UAV Applications
The utility offered by flexible circuits in UAVs mimics the advantages that make it popular in other portable electronic applications: lightweight, thin, highly reliable, flexible during use, and an ability to electrically connect across multiple layers as part of a complete packaging interconnect solution.
iNEMI Managing Director: New, Disruptive Technology on the Horizon
Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.
The Future of Nickel in Nickel/Palladium/Gold Final Finishes
Final finishes can be subdivided into metallic and organic finishes. For the purpose of this article, the focus will be on the metallic finishes using the combinations of nickel (Ni) and/or palladium (Pd) and/or gold (Au). Variations on this theme are used extensively in the electronics market of today. The Ni/Pd/Au mutations are the inevitable result of technical requirement changes coupled with true and perceived acceptance within the industry.
IPC Plating Sub-committee 4-14: Surface Finish Specifications
IPC specifications are reference documents to be called out by designers and OEMs. Designers may take exception with one or more items in the specification to ensure that the product meets the requirements of its intended use. The acronym AAUBUS (as agreed upon between user and supplier) is part of any specification. Specifications are consensus documents. They are agreed upon by a panel of interested industry participants composed of suppliers, manufacturers, assembly houses (CMs) and end-users. The IPC Plating Sub-committee 4-14 is no exception.
The Importance of Harmonized Standards that Benefit All
I-Connect007 Technical Editor Pete Starkey caught up with Amphenol applications engineer Sean Keating at IPC APEX EXPO. Keating explains his company’s commitment to proactive participation in the establishment of standards, his personal experience working on standards committees, and his view on the importance of harmonised global standards.
An Interview with Gardien Group’s Jason Fraser
Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.
Being Flexible in a Rigid World
With double-digit growth in the foreseeable future, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult-to-plate materials.
IMPACT 2015: An In-Depth Look
IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. That is why 22 IPC member-company executives descended on the nation’s capital for IMPACT 2015: IPC on Capitol Hill, IPC’s annual advocacy event.
Advances in Electronics Assembly Technology - SMART Group Seminar Preview
In a preview webinar to introduce the upcoming SMART Group seminar where the latest advances in assembly technology and reliability will be discussed by industry and subject experts, SMART Group Technical Committee members Charles Cawthorne from MBDA and Ian Fox from Controls and Data Services summarized the papers to be presented.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
The Growing Role of the Added-Value PCB Distributor
Dan Beaulieu talks with Nesh Dholakia, president of Nujay. Value-add is not just for low-technology sourcing, but increasingly for high-technology multilayer as well as difficult-to-source technologies in low-cost areas domestically.
Splitting Hairs: The Manufacture of HDI and Substrate Test Fixtures
The HDI and substrate fixture technology is truly an art form. Long gone are the luxuries of just using a plated drill file on an old drill machine and automatically dropping pins. Even the multi-plate fixtures that are used today have no comparison to the critical manufacturing requirements of the HDI and substrate fixtures.
High-Density Interconnects: Enabling the Intelligence of Things
HDI layers and sub-composites with laser-drilled vias combined with stacked, copper-filled vias up to 16 layers have become the state-of-the-art in circuit design for the newest generation of mobile phones, wearable electronics, and IoT modules.
IPC Validation Services 2014
Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.
Next-Generation Ultra-Thin HDI PCB Manufacturing Challenges
This article describes the recent challenges and developments in manufacturing ALV HDI technology to meet the needs for high volume, robust, reliable, and cost competitive solutions for electronic packaging.
A Conversation (and Day) with Joe Fjelstad, Part 5
Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.
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