Latest Articles

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

EIPC’s Winter Conference in Lyon, France: Day 2 Review

The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!

Blue Sky for Eagle Electronics

I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.

Start Your IPC APEX EXPO Show Experience Here

As many prepare to travel to California from February 24 to March 1, IPC APEX EXPO 2018 will offer a collection of exciting events for both newcomers and industry veterans, including educational opportunities and showcase exhibitions. Want a sneak peek into the upcoming events at IPC APEX EXPO 2018? This exclusive pre-show coverage publication from I-Connect007 is all about San Diego or bust!

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!

CircuitData: Creating an Open Source Language for PCB Data Exchange

I recently had the opportunity to speak with Elmatica CTO Andreas Lydersen on a subject of great interest to him and his supply chain, namely CircuitData. This open source language promises to greatly improve communication of details that can often be misinterpreted due to the differences in terminology used throughout the supply chain.

Who Really Owns the PCB Layout? Part 2

In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.

Whelen Engineering and AWP Explain their Unique Collaboration

If there was a buzz word in the PCB hall at productronica this year, it was probably Whelen, as in Whelen Engineering and Alex Stepinski, VP of Whelen’s circuit board division.

Aismalibar on Laminates, Following the Market, and More

At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.

EMA Cloud Lined with Capability

Editor Kelly Dack speaks with EMA Design Automation Marketing Manager Chris Banton about the company's new free cloud-based OrCAD schematic capture tool, OrCAD's design constraint manager, and the Sigrity electrical rule checker.

Rogers Continues Expansion into High-Speed Digital Materials

Mahyar Vahabzadeh discusses a paper presented by his colleague Dr. Allen Horn at DesignCon. He also explains some of the different characteristics Rogers has discovered as they move from RF into high-speed digital materials.

APCT’s Cartel Acquisition Adds Capacity, Technology and Certifications

APCT recently acquired Cartel Electronics and its affiliate, flex and rigid-flex maker Cirtech. During DesignCon 2018, I spoke with APCT President and CEO Steve Robinson about what this acquisition means for the San Jose-based fabricator.

CFX: Updates and Developments

In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.

Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design

This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.

Entering—and Enjoying—the Industry

I was recently given the opportunity to write an article for our publication. Being somewhat new to this industry, I figured it would be a good idea to write an introduction on how I got into electronics—specifically the part most people my age don’t give thought to.

All the Details on IPC’s Emerging Engineer Program

Teresa Rowe and Nancy Jaster, in charge of IPC’s Emerging Engineer Program, explain to I-Connect007’s Patty Goldman and Jonathan Zinski how this novel approach to attracting and supporting young people works.

Solder Limits: Updates for the Age of Surface Mount

Solder limits are one of the fundamental parameters used when evaluating the PCB, solder resists, and metal-clad base materials for safety under the UL Recognition programme.

IPC APEX EXPO: App is Where It’s At

In an interview with I-Connect007, IPC Exhibits Manager Kim DiCianni discusses the IPC APEX EXPO 2018 app and how this powerful tool will keep attendees on track. She also highlights its usefulness for exhibitors.

The Best It’s Ever Been, Every Year: The Goal for IPC, Part 2

In the continuation of this interview, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.

The Best It’s Ever Been, Every Year: The Goal for IPC, Part 1

The end of 2017 caps an exciting time for IPC and IPC China as membership has grown substantially, in part because of new offerings from the organization to its Asian members. Meeting with Barry Matties at HKPCA, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.

Staying Ahead of Market Trends Through Education

ESI equipment has been in high demand with the recent rise of flex and HDI. But when Barry Matties met with Patrick Riechel and John Williams at HKPCA, they explained that it is really ESI’s future protection and flexibility in the process that keeps them ahead of the market and allows for ongoing success.

Nano Dimension’s 3D Printing: Prototypes at the Push of a Button?

SICK AG is a global manufacturer of sensors and sensor solutions for industrial applications, with headquarters located in Waldkirch, Germany. After a demo of Nano Dimension’s new 3D printing machine at productronica, Barry Matties met with SICK’s Danny Wernet to discuss its pros and cons and get his overall impression of the technology. Are 3D prototypes really as simple as feeding in a Gerber file and pushing a button?

PCB Cooling Strategies, Part 2

In many PCB designs, component placement plays a decisive role in PCB cooling. But for some boards with areas of high heat and high current, the designer may have to utilize heat sinks, fans, and/or water cooling technology. There are a variety of cooling and heat dissipation options available now, but thermal management research still has a long way to go.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in