-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
DesignCon Returns to Santa Clara
December 29, 2022 | DesignConEstimated reading time: 2 minutes
DesignCon, the nation's must-attend event for chip, board and systems design engineers, today announces registration for the Jan. 31- Feb. 2 event at the Santa Clara Convention Center is now live. The 2023 expo will host technical paper sessions, tutorials, industry panels, product demos, 120+ exhibits and present some of the industry’s most influential companies, including host sponsor Amphenol and others such as Cadence, Keysight, Molex, Mouser, Samtec, and TE Connectivity.
DesignCon, the premier high-speed communications and system design conference and exposition, will host three days of deeply technical conference opening and two days of exhibition. All conference passholders will have access to 14 tracks of education created by engineers, with more than 100 sessions curated by the 97-person Technical Program Committee, which are expertly reviewed by the advising panel of engineers each year to meet the needs of the ever-evolving industry.
“We could not be prouder to facilitate an outlet where learning is at the forefront for this high-powered industry, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley,” says Suzanne Deffree, Group Event Director of DesignCon. “It is rewarding to connect the industry’s leading professionals with DesignCon as the live hub to showcase creativity and ingenuity that the design engineering trade is bringing to new heights.”
The global engineering and design market is projected to grow to $1.5 Tn by 2023. DesignCon aims to address the main contributors to this market, such as the projected growth of global 5G technology market to $700 B; expected $1.3 Tn value of Internet of Things (IoT) over the next three years; the $519.65 B size of the electronic components market by this coming year; and other areas of growth such as autonomous driving, cables and connectors, EDA software, printed circuit boards, and test and measurement.
DesignCon will also host Drive World for the third year to help advance the automotive sector with access to technical education on automotive electronics and intelligence alongside design engineering content. With the automotive artificial intelligence market projected to grow over 30% from 2021-2026 and expected to reach USD 16.2 Billion in 2026, Drive World’s educational offerings on automotive technology are a must-attend for electrical and mechanical engineers looking help accelerate the path to autonomous driving.
Five webinars will also be available on DesignCon’s digital platform prior to the in-person event for all registered attendees. These webinars, as well as select sessions recorded at the live event, will be available for viewing on the Smart Event platform through the end of February. The digital platform also provides the opportunity to research suppliers and products and network before and after attending DesignCon in Santa Clara, CA.
DesignCon's "Engineer of the Year" Award will also be given during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level. The award winner is selected based on his or her leadership, creativity, and out-of-the-box thinking brought to designing and testing of chips, boards, and systems, with particular attention paid to areas of signal and power integrity. Voting for the 2023 Engineer of the Year Award open December 23, at https://forms.gle/sCYyBL5GwjBgpg1c8.
Registration is now open for all attendees, visit www.designcon.com to get a pass.
Suggested Items
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.