Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 12, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
As we publish this week’s most-read news, the I-Connect007 team is wending its way home from an eventful and productive week at IPC APEX EXPO in Anaheim, California. We’ve posted a variety of dispatches from the show this week, released 73 realtimewith.com video interviews (and counting), and also gathered the content and updates you’ll be looking for in the upcoming issue of Show & Tell… IPC APEX EXPO 2024.
With all the action this week, I will admit that I’m still processing everything I heard, saw, and learned. Furthermore, I can’t boil it down to just five news items. So, here’s a bonus list of worthwhile news items from the week—mostly IPC APEX EXPO related—that you should be aware of.
If you want to know what happened at the trade show, be sure to read our daily reports on show activities and snippets of events and activities.
SIA Applauds CHIPS Act Incentives for TSMC’s Advanced Manufacturing Operations in Arizona
IPC Releases “J” Revisions to Two Leading Standards for Electronics Assembly
Feeling the Magic of a Show Opener at IPC APEX EXPO 2024
The Shaughnessy Report: Design Takes Center Stage at IPC APEX EXPO
A Closer Look at Professional Development at IPC APEX EXPO 2024: 3D Printing and AI
Calumet Electronics Boosts PCB Production Capacity with Strategic CapX
U.S. Updates Advanced Semiconductor Ban, Actual Impact on the Industry Will Be Insignificant
lPC Shipments Return to Growth and Pre-Pandemic Volumes in Q1 of 2024
IPC Publishes Comprehensive Strategy to Address Electronics Industry’s Global Workforce Challenge
IPC Announces New Board Members at IPC APEX EXPO 2024
IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards
IPC Design Competition: On Your Mark, Get Set, Go!
IPC APEX EXPO 2024 Day 2: A Focus on Workforce Development
Emerging Engineers Get Formal Introduction to IPC APEX EXPO 2024
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.