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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Mentor Graphics' 2017 PCB Forum Announces May, June Dates
April 18, 2017 | Mentor GraphicsEstimated reading time: Less than a minute
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Simon Khesin - Schmoll MaschinenSuggested Items
Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.
03/11/2026 | Ventec International GroupVentec International Group invites attendees of APEX EXPO 2026 to Booth 4642 to experience its Glass Free Revolution and the official launch of chiplam, a new high-performance materials portfolio for advanced semiconductor packaging and test applications.
SMTA Space Coast: What's Needed to Modernize Defense Solder Standards
12/23/2025 | Nolan Johnson, I-Connect007Long-time lead-free solder investigator, Denny Fritz, hit the SMTA Space Coast Expo in November to drum up support for an initiative to include lead-free solder in milaero-based printed circuit board assemblies. In this interview, Denny provides background on the genesis of the “consider all solders” project and why it matters to continue leading this effort.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.