Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
Mentor Graphics' 2017 PCB Forum Announces May, June Dates
April 18, 2017 | Mentor GraphicsEstimated reading time: Less than a minute
The 2017 PCB Forum has opened for registration. Save a seat today! Each PCB Forum is a one-day event where you will learn how to align your PCB design environment with your needs to ensure delivery of quality products, earlier.
These events are free of charge. Lunch and refreshments are complimentary.
Where and When
RTP, NC – May 9
Atlanta, GA – May 11
Boston, MA – May 23
Orlando, FL – June 15
Do you have comments or questions? Ask the event team at PCB_Forums@mentor.com.
Share on:
Suggested Items
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
Electroninks' MOD and iSAP Game Changers
03/25/2025 | Marcy LaRont, PCB007 MagazineElectroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
03/03/2025 | Rogers CorporationRogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.
New Book Explores History of X-ray Technology and Application in Electronics Today
03/05/2025 | I-Connect007As the field of electronics continues to evolve, X-ray inspection has become an indispensable tool for ensuring quality and reliability in manufacturing processes. In The Printed Circuit Assembler’s Guide to... X-ray Inspection, author Dr. Bill Cardoso, Creative Electron, discusses the development of contemporary X-ray machines, which incorporate advanced imaging, motion, and decision-making steps that facilitate precise defect detection.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in