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I-Connect007 Launches ‘The Printed Circuit Designer’s Guide to… Signal Integrity by Example’ Micro eBookAugust 15, 2017 | Emmy Ross, I-Connect007
Estimated reading time: 2 minutes
I-Connect007 is excited to announce the release of the next book in our micro eBook Design series: The Printed Circuit Designer’s Guide to… Signal Integrity by Example.
The Printed Circuit Designer’s Guide to…is an ongoing series of micro eBooks specifically dedicated to the education of PCB designers. This book series has become the gold standard for people seeking the most relevant design information available.
The latest title in this new line of eBooks, The Printed Circuit Designer’s Guide to… Signal Integrity by Example, is authored by Fadi Deek of Mentor, a Siemens business. This free micro eBook details the importance of eliminating signal integrity challenges. The chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles.
“This eBook looks under the hood and identifies two often neglected sources of reflections: the package model and the input gate capacitance of the receiver. Considering these two features, many of the mysterious ringing effects are instantly understood,” says Dr. Eric Bogatin, dean of the Teledyne LeCroy Signal Integrity Academy.
This eBook has something to offer any engineer interested in identifying problems, root causes, and solutions surrounding electronic transmissions.
We welcome you to download this book for free by visiting www.I-007eBooks.com/SIE. You can find all of the titles in our eBook series by visiting our library at www.I-007eBooks.com.
Here are some other exciting titles in our micro eBook series:
The Printed Circuit Buyer’s Guide to… AS9100, by Imagineering, Inc.
The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals, by American Standard Circuits
The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 1,by Polar Instruments
The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 2,by Polar Instruments
- The Printed Circuit Assembler’s Guide to…Conformal Coatings, by Electrolube
The Printed Circuit Designer’s Guide to… Power Integrity by Example, by Mentor, a Siemens Business – coming soon!
The Printed Circuit Designer’s Guide to…Executing Complex PCBs, by Freedom CAD – coming soon!
The Printed Circuit Designer’s Guide to…Documentation, by DownStream Technologies – coming soon!
The Printed Circuit Designer’s Guide to…Thermal Management, by Ventec International Group – coming soon!
We hope you enjoy The Printed Circuit Designer’s Guide to… Signal Integrity by Example in eBook format, if you'd like to order this book from our print-on-demand service, click here.
For more information, contact:
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The proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 202409/14/2023 | MediaTek
MediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.