-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Nine Dot Connects and Solidworks Roadshow: PCBs in the Age of Mechatronics
August 16, 2017 | Nine Dot ConnectsEstimated reading time: Less than a minute
Nine Dot Connects, the only nationwide VAR for the SOLIDWORKS PCB design suite, along with representatives from SOLIDWORKS, will be presenting "The Age of the Fabricated Mechatronics Board" in 12 cities throughout the U.S. starting in September. This lunchtime presentation will review the key innovations that drive the PCB as we know it today, and the migration and inevitable integration of ECAD and MCAD tools. This is a must-see for anyone who wishes to embrace the next generation of technologies that will tightly couple both electrical and mechanical elements of the design.
For more information about locations, agenda, and registering, please click here.
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Microsoft’s Brad Smith Urges U.S. Leadership in Quantum Technology
04/29/2025 | I-Connect007 Editorial TeamIn a blog post published on April 28, 2025, Brad Smith, Vice Chair and President of Microsoft, underscores the critical need for the United States to accelerate investment in quantum technology. While public focus remains fixed on artificial intelligence, Smith argues that quantum computing is an equally vital frontier with the power to revolutionize industries and solve complex global challenges across science, medicine, energy, and agriculture.