Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Indium Powers the Future with Advanced Materials Solutions at CIPS 2026

02/26/2026 | Indium Corporation
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International Conference on Integrated Power Electronics Systems, March 10-12, in Dresden, Germany.

ITW EAE Releases EcoWave Option for Electrovert Wave Soldering

02/25/2026 | ITW EAE
ITW EAE announces the launch of the Electrovert EcoWave, a patented next‑generation wave soldering option engineered to deliver significant gains in efficiency, soldering performance, and sustainability.

New SASinno Ultra-i1 Gives K&F Electronics Added Flexibility in Selective Soldering

02/16/2026 | K&F Electronics
K&F Electronics, a third-generation, family-owned electronics assembly provider, has installed a SASinno Ultra-i1 offline selective soldering system, expanding its selective soldering capacity and improving process consistency for customer programs that require precise, repeatable results.

Dr. Jennie Hwang to Deliver PDCs on AI and High Reliability at APEX EXPO 2026

02/13/2026 | Dr. Jennie Hwang
Dr. Jennie Hwang, chair of the AI Committee of the National Academies/DoD AI study, chair of the National AI Institute of NSF, and chair of the Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and integrated insights to her AI course, “Artificial Intelligence and AI-Powered Electronics Manufacturing” at APEX EXPO 2026 on Sunday, March 15.

Rehm Showcases Future Technologies for Electronics Manufacturing Live at APEX EXPO 2026

02/11/2026 | Rehm Thermal Systems
Rehm Thermal Systems will present current solutions for conformal coating and dispensing, resource-efficient vapor phase soldering, and nitrogen reflow soldering. Visit us at booth 942 and experience our technologies live on site.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in