-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
February 25, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle.
NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
In “Semi-Flex Design Guidelines,” the team addresses applications that require limited bending without the added cost and complexity of fully flexible circuits. The paper explains how designers can select thin rigid FR-4 materials to enable controlled bending during installation, while emphasizing that semi-flex designs are best suited for static or limited-bend applications. Key considerations include minimum bend radius, copper distribution in bend areas, layer symmetry, and the use of flexible solder mask or coverlay to reduce mechanical stress.
NCAB extends its design-for-manufacturing approach in “Ultra HDI Design Guidelines,” which tackles the challenges of shrinking geometries and increasingly dense interconnect structures. The paper outlines practical design rules for microvias, pad sizes, dielectric thicknesses, and stackups that support both manufacturability and electrical performance as designs move beyond traditional HDI limits.
In “Stackups and Impedance Design Guidelines,” the focus is on the structural foundations that support signal integrity. This paper explains how symmetrical stackups, controlled dielectric spacing, and consistent copper weights help designers meet impedance targets while minimizing warpage in high-speed and high-frequency applications.
In “Multilayer Design Guidelines,” the authors address copper balance, via strategies, and drilling tolerances. These fundamentals help designers achieve stable manufacturing outcomes as board complexity and layer counts continue to increase.
Together, NCAB Group’s white papers reflect a design-for-manufacturing mindset. By translating fabrication constraints into actionable design guidance, the authors help engineers improve reliability, reduce rework, and achieve more predictable results.
Visit the I-Connect007 Industry Resource Center to explore these resources—and many more—designed to strengthen your PCB design strategy.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
BAE Systems Finishes Preliminary Design Review for U.S. Space Force Missile Satellite
03/16/2026 | BAE SystemsBAE Systems has completed the Preliminary Design Review for the $1.2 billion U.S. Space Force (USSF) Space Systems Command (SSC) Resilient Missile Warning & Tracking (RMWT) – Medium Earth Orbit (MEO) Epoch 2 program to provide missile warning and tracking of advanced missile threats.
RBB Systems, USA Firmware Announce Engineering Partnership
03/16/2026 | RBBRBB, a trusted leader in electronics manufacturing since 1973, has entered into a new partnership with USA Firmware, an engineering firm specializing in embedded systems, firmware development, and product design.
Imec Launches University Consortium Around Next Generation of Chips
03/13/2026 | ImecImec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first of its kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0).
India Advances Toward 85,000 Semiconductor Engineers Under C2S
03/12/2026 | PIB DelhiGovernment of India’s initiative for prioritizing talent development through Training, Up-skilling and Workforce Development Programs under Chips to Startups (C2S) initiative of India Semiconductor Mission (ISM), Union Minister for Railways, Information & Broadcasting, and Electronics & IT, Ashwini Vaishnaw, stated that India has made significant progress in last 04 years itself for its 10-year target of training 85,000 engineers in semiconductor design.
Automating the Repeatable Parts of Hardware Design
03/12/2026 | Kyle Dumont, AllSpice.ioDespite working on some of the most sophisticated technology in the world, many hardware engineers still rely on spreadsheets, tribal knowledge, and sometimes, quite literally, pen, paper, and a highlighter. Delivering new hardware products on schedule often comes down to finding a needle in a haystack disguised as a 900-page specification or datasheet. AllSpice.io set out to automate the repeatable parts of hardware design: the well-defined, rules-based tasks that make sure nothing gets missed and everything lines up.