-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
February 25, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle.
NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
In “Semi-Flex Design Guidelines,” the team addresses applications that require limited bending without the added cost and complexity of fully flexible circuits. The paper explains how designers can select thin rigid FR-4 materials to enable controlled bending during installation, while emphasizing that semi-flex designs are best suited for static or limited-bend applications. Key considerations include minimum bend radius, copper distribution in bend areas, layer symmetry, and the use of flexible solder mask or coverlay to reduce mechanical stress.
NCAB extends its design-for-manufacturing approach in “Ultra HDI Design Guidelines,” which tackles the challenges of shrinking geometries and increasingly dense interconnect structures. The paper outlines practical design rules for microvias, pad sizes, dielectric thicknesses, and stackups that support both manufacturability and electrical performance as designs move beyond traditional HDI limits.
In “Stackups and Impedance Design Guidelines,” the focus is on the structural foundations that support signal integrity. This paper explains how symmetrical stackups, controlled dielectric spacing, and consistent copper weights help designers meet impedance targets while minimizing warpage in high-speed and high-frequency applications.
In “Multilayer Design Guidelines,” the authors address copper balance, via strategies, and drilling tolerances. These fundamentals help designers achieve stable manufacturing outcomes as board complexity and layer counts continue to increase.
Together, NCAB Group’s white papers reflect a design-for-manufacturing mindset. By translating fabrication constraints into actionable design guidance, the authors help engineers improve reliability, reduce rework, and achieve more predictable results.
Visit the I-Connect007 Industry Resource Center to explore these resources—and many more—designed to strengthen your PCB design strategy.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
DesignCon 2026: From Copper to Quantum to Agentic AI
02/26/2026 | Kelly Dack, I-Connect007Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.
Technology Pavilion Debuts at APEX EXPO 2026
02/26/2026 | Global Electronics AssociationMany of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.
Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale
02/25/2026 | BUSINESS WIREVinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.
DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate
02/24/2026 | GlobeNewswireDesignCon, the premiere event for the latest in high-speed design tools, technologies, and developments, has announced the keynote speakers for the 2026 edition.
Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
02/24/2026 | BUSINESS WIREBaya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company.