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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Matrix Electronics Mourns the Passing of James 'Jim' Kenney
March 30, 2018 | Matrix ElectronicsEstimated reading time: Less than a minute
On March 9, the members of Matrix lost a dear friend, Jim Kenney. Jim was dedicated and hardworking, meticulous in every task he undertook. Jim had a long history in the PCB Industry and was well known throughout the country and especially in the Western US. Jim had previously worked for CIS (Circuit Image Systems) and more recently with Matrix USA for the past five years. He was instrumental in launching Matrix’s new line of Hakuto Film Lamination products.
Jim passed at home in Oregon with his wife, Debra, and family. He leaves behind six children and nine grandchildren.
Jim will be sorely missed and remembered by everyone who knew him for his good nature, honesty and persistent dedication.
Suggested Items
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
Real Time with... IPC APEX EXPO 2025: Exploring Burkle's Innovations at IPC APEX EXPO 2025
03/27/2025 | Real Time with...IPC APEX EXPOBurkle North America's Andy Turner shares insights from the show, highlighting the excitement surrounding the event and Burkle North America's growth potential. He invited attendees to their booth to interact with the InfoCube, a cutting-edge touchscreen showcasing Burkle's diverse product offerings.
All Flex Solutions Upgrades Lamination Layup
01/17/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.