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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Matrix Electronics Mourns the Passing of James 'Jim' Kenney
March 30, 2018 | Matrix ElectronicsEstimated reading time: Less than a minute
On March 9, the members of Matrix lost a dear friend, Jim Kenney. Jim was dedicated and hardworking, meticulous in every task he undertook. Jim had a long history in the PCB Industry and was well known throughout the country and especially in the Western US. Jim had previously worked for CIS (Circuit Image Systems) and more recently with Matrix USA for the past five years. He was instrumental in launching Matrix’s new line of Hakuto Film Lamination products.
Jim passed at home in Oregon with his wife, Debra, and family. He leaves behind six children and nine grandchildren.
Jim will be sorely missed and remembered by everyone who knew him for his good nature, honesty and persistent dedication.
Suggested Items
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.
TTM Selects Lamination Press From Lauffer and all4-PCB for New Syracuse Facility
09/10/2024 | all4-PCBall4-PCB is pleased to announce that TTM Technologies has chosen Lauffer GmbH & Co., Germany to supply the automated multilayer press system for TTM’s new facility in Syrcause, New York. The system will include hot and cold presses, storage towers, lay-up and depinning stations.
Connect the Dots: Designing for Reality—Lamination and Materials
06/19/2024 | Matt Stevenson -- Column: Connect the DotsAs many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating
05/29/2024 | Neil Hubble, AkrometrixMoisture sensitivity requirements for non-hermetic surface mount devices are defined in the joint IPC/JEDEC standard J-STD-020E, “Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Non-hermetic Surface-Mount Devices,” last updated in December 2014. This standard allows customers and suppliers to place electronics devices into specific categories, defined into 8 different moisture sensitivity levels (MSL). Test method criteria are defined within this standard to define MSL levels for different packages. A subsection of MSLs are shown in Figure 1 below, showing the MSL 3 and 4 used in this study.
Ventec Giga Solutions Announces Exclusive Refurbishment Service for PCB Lamination Plates
02/22/2024 | Ventec International GroupVentec Giga Solutions, the equipment division of Ventec International Group, has started offering a refurbishment service for separator plates used in PCB lamination processes.