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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Matrix Electronics Mourns the Passing of James 'Jim' Kenney
March 30, 2018 | Matrix ElectronicsEstimated reading time: 1 minute
On March 9, the members of Matrix lost a dear friend, Jim Kenney. Jim was dedicated and hardworking, meticulous in every task he undertook. Jim had a long history in the PCB Industry and was well known throughout the country and especially in the Western US. Jim had previously worked for CIS (Circuit Image Systems) and more recently with Matrix USA for the past five years. He was instrumental in launching Matrix’s new line of Hakuto Film Lamination products.
Jim passed at home in Oregon with his wife, Debra, and family. He leaves behind six children and nine grandchildren.
Jim will be sorely missed and remembered by everyone who knew him for his good nature, honesty and persistent dedication.
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Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers
12/18/2025 | Team NCAB -- Column: Fresh PCB ConceptsWhen you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement.
Alpha Insights, Performance by Design: An Independent Perspective on the State of HDI Manufacturing
12/16/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignIn today’s electronics landscape—where routing densities continue to rise, and margin for error is shrinking—HDI fabrication has become a defining factor in whether products launch on time and perform as intended. Engineers and program teams now view HDI less as a specialty and more as a foundational requirement, particularly in sectors such as telecom, RF, aerospace, semiconductor test, medical devices, and advanced computing.
Driving Innovation: The Flash Cutting Process
12/08/2025 | Simon Khesin -- Column: Driving InnovationDuring the creation of a multilayer board, the lamination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consistency and size of this flash provide process engineers with valuable insight into lamination parameters, the flash itself must be completely removed before subsequent manufacturing steps.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.