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Avnet Announces Release of Autodesk Fusion Integration

10/16/2024 | Avnet
Design engineers can now access thousands of reference design schematics, lead time and pricing trends, and fast alternate guidance with the launch of the Avnet App, an add-in for Autodesk Fusion.

iNEMI End-of-Project Webinar: Investigation of AI Enhancement to AOI for PCBA

10/16/2024 | iNEMI
Automated optical inspection (AOI) systems are essential in electronic manufacturing for ensuring the quality of printed circuit board assemblies (PCBAs).

SIA Applauds CHIPS Act Incentives for Wolfspeed Manufacturing in North Carolina and New York

10/16/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Wolfspeed.

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Airbus, European Partners Demonstrate Collaboration Between Helicopters and Unmanned Systems

10/14/2024 | Airbus
Airbus Helicopters and its partners have conducted a full scale demonstration of a manned-unmanned teaming (MUM-T) system developed as part of a project funded by the European Union and code-named MUSHER.
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