Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Air Force Awards Intellisense $8.22M for Nuclear Flash Blindness Goggles

08/10/2026 | PRNewswire
Intellisense Systems, Inc. has been awarded an $8,218,891 Cost Plus Fixed-Fee (CPFF) Engineering and Manufacturing Development (EMD) and Low-Rate Initial Production (LRIP) contract to develop Next Generation Nuclear Flash Blindness protection systems to protect aircrews from nuclear flash blindness.

Global PCB Connections: The Future of HDI PCBs

01/16/2025 | Markus Voeltz -- Column: Global PCB Connections
High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.

Quiet Power: An Evolution in PCB Design Costs

09/04/2024 | Istvan Novak -- Column: Quiet Power
In this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.

Trouble in Your Tank: Processes to Support IC Substrates, Advanced Packaging—Part 1

03/07/2023 | Michael Carano -- Column: Trouble in Your Tank
There has been much written and discussed over the last 18 months relating to semiconductor fabrication and the well-founded concerns that the U.S., in particular, has fallen behind in domestic chip manufacturing. In response to this issue, the United States government has enacted the CHIPS for America Act. Funding under this legislation is designed to drive more chip fabrication domestically. While this is all fine and good, once these advanced chips are manufactured, where will they go? As has been said ad nauseum, “Chips don’t float.”

A Challenge Facing Aerospace Designers In 2023

01/24/2023 | Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in