Global Citizenship: Comparing and Contrasting the U.S. and China PCB Industries
Standard of Excellence: Finding and Hiring the Right Candidates for Engineering Positions
Global Sourcing Spotlight: 10 Rules of the Game
Qualcomm, Alps Alpine to Deliver Advanced Automotive In-Cabin Capabilities
January 6, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
Qualcomm Technologies, Inc. and Alps Alpine Co., Ltd. announced their joint work to deliver the Digital Cabin – a proposal for future mobility to enrich a space of style and comfort, even behind the cockpit. The Digital Cabin uses High-Performance Reference Architecture (HPRA), Alps Alpine’s original integrated electronic control unit (ECU) powered by the 3rd Generation Snapdragon® Cockpit Platforms. HPRA is used to perform software processing for the Digital Cabin via human-machine interface (HMI), sensor and connectivity technologies, enabling advanced infotainment and cockpit capabilities in the vehicle.
The 3rd Generation Snapdragon Cockpit Platforms from Qualcomm Technologies are artificial intelligence (AI)-based platforms designed to support higher levels of compute and computing intelligence needed for advanced capabilities featured in next-generation vehicles. By using the platforms to power HPRA, Alps Alpine aims to deliver safety, comfort and top-of-the-line entertainment solutions. This work reflects Qualcomm Technologies’ and Alps Alpine’s continued commitment to delivering unmatched, next-generation experiences within the automotive cabin and cockpit. The Digital Cabin technologies from Alps Alpine, powered by Qualcomm Technologies, include an e-mirror providing a peripheral view with dramatically reduced blind spots, next-generation input and output devices integrated into door trims, a large ceiling display, and sound zones that project sound individually to each person.
By combining Alps Alpine’s HMI, sensor, connectivity and infotainment technology with Qualcomm Technologies’ fully scalable cockpit solutions – designed with a modular architecture to allow automakers to deliver a variety of customizable options for their consumers – the companies are further enhancing the digital in-vehicle experience.
“We are excited to continue our work with Qualcomm Technologies to deliver advanced in-vehicle solutions that combine high-performance telematics solutions with enhanced connectivity,” said Yoshikatsu Watanabe, vice president, infotainment business, Alps Alpine Co., Ltd. “The Snapdragon Cockpit Platforms have allowed us to design unrivaled capabilities in the car, achieving our goal of delivering one-of-a-kind experiences to drivers and passengers.”
“We deeply value our work with Alps Alpine and are confident that, together, we will continue to transform in-vehicle experiences,” said Shyam Krishnamurthy, vice president, product management, Qualcomm Technologies, Inc. “By powering HPRA, we are bringing the benefits of next-generation telematics, high-speed connectivity and powerful compute capabilities to the car.”
The Digital Cabin using HPRA and powered by the 3rd Generation Snapdragon Cockpit Platforms was first showcased in Japan in 2020. Alps Alpine aims for these features to be commercially available in 2024.
Share on:
Suggested Items
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.