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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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ExpressPCB Announces ExpressSCH Plus and ExpressPCB Plus Version 3.1May 2, 2022 | ExpressPCB
Estimated reading time: 1 minute
ExpressPCB® is excited to announce the expansion of its Schematic Link and Netlist Validation tools to fully support the use of symbols in ExpressCSH Plus®. With the release of ExpressPCB Plus® Layout Software version 3.1 they expand the designer’s ability to create complex, multipage schematics, and fully validate the PCB layout.
ExpressPCB customers were very responsive to the version 3.1 release, and provided excellent feedback to help guide the development of the latest version. With more robust support of symbols used in ExpressSCH Plus, there is now improved speed, stability, and quality of results in the Schematic Link and Netlist Validation tools.
“Our user community has emphasized the importance of schematic link and support for symbols in their design practices. We took the time to work directly with several customers as we developed our tools, to address their needs. The result is a robust tool set that helps designers projects move from concept to reality with confidence.” - Michael Hebda, Product Manager
With additional updates to the SnapEDA API to provide current component pricing, availability, and purchase links; ExpressPCB continues to build simple, easy to use solutions for the overall design and fabrication processes.
The Schematic and Layout tools are simple and unencumbered by multiple layers of menus, options and settings that more advanced PCB Design suites require mastering before you even start on your design project. If time is of the essence and there is a need to quickly turn out a prototype to get a project off the ground, then ExpressPCB is a great choice.
ExpressPCB® is an established leader in providing software and manufacturing solutions for high quality, low cost, and quick turnaround prototype circuit boards. With more than 20 years of experience and over 1 million successfully completed PCB projects behind them, customers can experience the difference that they bring to the electronics industry. ExpressPCB is committed to improving the overall process for design engineers of all levels and abilities with the fastest to learn layout software available with seamless integration to PCB ordering and manufacturing.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.