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StenTech to Showcase Advanced Nano Coating and Stencil Solutions at SMTA Chihuahua
August 24, 2023 | StenTechEstimated reading time: 1 minute
StenTech Inc., the leading multinational SMT Printing Solutions company, is excited to announce its participation at SMTA Chihuahua, taking place on Thursday, Sept. 7, 2023 at the Sheraton Chihuahua Soberano. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling.
As electronic packaging continues to push the boundaries of miniaturization, the challenge of achieving precise solder paste deposition and meeting evolving IPC requirements remains ever-present. StenTech's award-winning Advanced Nano Coating provides a groundbreaking solution to this challenge. This highly unique 1-3 um hardened nano coating, applied to the bottom side and inside the apertures of the stencil, offers exceptional anti-adhesion properties, effectively repelling solder flux and ensuring increased transfer of paste.
With StenTech's Advanced Nano Coating, transfer efficiency can be boosted by up to 25 percent, resulting in a significant reduction of bridging and paste-related defects. The "non-stick" characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and reduced expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use in just 30 minutes after coating, enhancing production efficiency and minimizing downtime.
StenTech's legacy of pioneering stencil technology, including the introduction of Fiber Diode lasers into North America, has firmly established the company as an industry leader. With a team of over 30 experienced CAD designers, StenTech provides unparalleled support in stencil modifications, material recommendations, and thickness specifications, ensuring optimized stencil solutions for every application.
At the SMTA Chihuahua expo, visitors to the StenTech booth will have the opportunity to explore the full range of stencil technology offerings, custom-tailored to meet specific manufacturing needs in the SMT industry. The company's dedication to innovation and customer satisfaction makes StenTech a trusted partner for companies seeking cutting-edge solutions to their electronic packaging challenges.
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The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/13/2024 | Marcy LaRont, PCB007 MagazineAt the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.