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Circuit Technology Center Announces Expanded Tinning Services Capacity
September 16, 2024 | Circuit Technology CenterEstimated reading time: 1 minute
Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning. The equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA's with lead-free solder to tin-lead solder.
These state-of-the-art machines are high-volume, high-mix systems featuring auto load/unload, multi-component vacuum pickup heads, and dynamic solder waves. All process parameters are controlled, including immersion depths, dwell times, insertion and extraction speed, acceleration, solder pump speed, and temperatures, ensuring that the tinning process complies with stringent industry standards including GEIA-STD-006, J-STD-001, and IEC-TS-62647-4.
"For over 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification, rework, and damage repair services," said Andy Price, Sales Manager. "We are thrilled to announce our increased capacity, offering our defense and high-reliability customers electronic component tinning and alteration services with the same exceptional quality and service that they have come to expect from our company."
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A Parametric Approach to the Environmental Impact of PCB Fabrication
09/09/2024 | Maarten Cauwe, imecSustainability for electronics is receiving more attention due to environmental concerns, regulatory obligations, and to ensure competitiveness in a growing market for sustainable products. To facilitate the discussion on the environmental impact of electronics, there is a strong need for data on energy use, carbon footprint, greenhouse gas (GHG) emissions, hazardous chemicals used during manufacturing, waste generation, etc.
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Quiet Power: An Evolution in PCB Design Costs
09/04/2024 | Istvan Novak -- Column: Quiet PowerIn this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.