I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Estimated reading time: 2 minutes

In the 24 years that I’ve been covering this industry, I don’t think I’ve ever had a boring day. There’s always something new happening in the world of PCB design and manufacturing. Each week, our contributors bring us a wide variety of articles, columns, and news items from around the globe.

This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. 

In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!

Pivoting on Substrates
Published September 27

Much of the discussion around the CHIPS Act focused on the need for greater supply chain for advanced packaging substrates. PCB Technologies is stepping up to the plate and investing in  facilities to design, fabricate, and assemble these substrates. CEO Oved Shapira recently spoke with the editorial team about his company’s plans and how this move could disrupt the electronics marketplace.

Rigid-flex Design Guidelines
Published September 27

Every year, traditional rigid board designers move into the world of rigid-flex. As the old saying goes, “It’s the same, but different.” Cherie Litson wrote a great article about the fundamentals of designing these 3D structures, and what rigid PCB designers need to know before they get started on their first rigid-flex design.

The New Chapter: The Pros and Cons of Tribal Knowledge
Published September 29

Tribal knowledge is a big part of the electronics industry, and like many ideas, it has its advantages and disadvantages. In this column, Paige Fiet discusses the pros and cons of tribal knowledge, as well as the loss of subject matter experts who are now facing retirement age. As she points out, it’s time to document this knowledge so that future generations can benefit from it.

UHDI Fundamentals: A Primer on UHDI 
Published September 28

As lines and spaces continue to shrink down to 1 mil and beyond, the industry must embrace an entirely new way of thinking. As Anaya Vardya explains, what worked in the past, when lines and spaces dropped to 3 mils, will no longer work. He also discusses the benefits of additive processes vs. traditional subtractive processes, which are not effective with UHDI technologies.

Smart Factory Insights: The Smart Business Case for Local PCB Manufacturing
Published September 29

In this column, Michael Ford explains why PCB manufacturers need to embrace Smart technologies. He also discusses what he calls “The 3 Ss” of manufacturing: a smarter, secure, and sustainable approach.