Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Saki to Highlight Advanced Inspection Innovation at NEPCON JAPAN 2024
December 19, 2023 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at the 38th Nepcon Japan at the Tokyo Big Site Exhibition Center. From January 24 to 26, visitors to the show will discover Saki’s state-of-the-art inline total inspection line solutions for Smart Factories and latest hard- and software innovations in the “Electrotest Japan” exhibition area on Booth 15-2 (East Hall 2) as well as on Booth 35-14 (East Hall 4) in the brand new “Power Device & Module Expo” area.
Saki will offer booth-visitors a first-hand look at the unique features that demonstrate its Full SMT Line, Smart Factory and M2M capabilities. These include the latest hardware and software releases with an emphasis on total inspection line solutions that offer reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets.
The show line-up will feature:
< Electrotest Japan - Booth 15-2 (East Hall 2) >
Saki's innovative single operation capabilities, together with a prototype of their software system called “One Programming / Saki Link”, will serve as a showcase for the company's data-driven approach to ongoing productivity enhancement. SPI, AOI, and AXI programming operability is unified, and device configurations are done in batches using a shared data library.
Alongside the new software system, QD Analyzer and Multi Process View (MPV) demo station will present Saki’s software strength that greatly improves process troubleshooting and determines root causes. These innovations will help clients increase automation to solve labor & resourcing issues, tackle skills shortages, improve productivity and achieve greater manufacturing quality and efficiency.
< Power Device & Module EXPO – Booth 35-14 (East Hall 4) >
The Power Device and Module Expo is a new addition to Nepcon Japan focusing on the automotive, energy, railroad, and industrial equipment sectors. Designed specifically for the power semiconductor manufacturing applications, Saki will exhibit its latest X-ray total automatic inspection system for power modules, the AXI 3Xi-M200, on a dedicated Saki booth #35-14 in East Hall 4.
With its special Planar-CT (PCT) scanning method, combined with advanced in-house image-processing algorithms that calculate the luminance of each pixel in three dimensions to reconstruct images with the maximum possible accuracy, Saki’s X-ray solution fulfills inspection capabilities and flexibility required by semiconductor manufacturers far beyond standard SMT inspection processes with precision, speed, and ease.
“We are looking forward to once again showcasing our latest technologies at Nepcon Japan. With our range of inspection machine and software solutions we aim to help address changes and challenges faced by electronic manufacturers today and in the future,” said Ken Katsumi, Chief Sales Manager of Saki’s Sales Headquarter.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.