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IPC Standards and Electronics Sustainability: More Than Meets the Eye
January 5, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: 1 minute
When we look at existing IPC standards, we see that most were created and intended to communicate and clarify expectations for superior quality, reliability, and consistency in electronics manufacturing. At first glance, their connection to sustainability is not obvious.
Yet as we continue to evaluate existing IPC standards against sustainability reporting best practices or requirements for companies in the electronics value chain, there are more than a dozen IPC standards that address important and relevant sustainability topics.
For example, training and education—a relevant and important industry sustainability topic covered by GRI standards—is represented in popular IPC standards, including IPC-A-610, Acceptability of Electronic Assemblies; IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies; and IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies; and the certification programs built around these standards.
The GRI (Global Reporting Initiative) standards focus on the environmental, social, and economic impacts of a company in relation to sustainable development. They represent global best practices for reporting publicly. GRI is just one of four frameworks sustainability disclosures identified as a driver causing companies in the industry to disclose data and information on various sustainability topics and targets. A recent exploratory materiality study of dozens of industry sustainability reports revealed that GRI, along with SASB, TCFD, and CDP, was strongly preferred and most used of the four.
To read the rest of this article, which appeared in the fall issue of IPC Community, click here.
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Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process
11/08/2024 | Michelle Te, IPC CommunityPCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
Nolan's Notes: The Rise (and Risk) of Data
11/05/2024 | Nolan Johnson -- Column: Nolan's NotesLast month, I read about a United Airlines flight that declared an emergency over the middle of Hudson Bay in northern Canada. All the cockpit screens had gone blank and both flight management computers had entered into a “degraded mode with limited capabilities.” The pilots had lost most of their autopilot functionality, but still had enough control systems to manually fly the plane to a safe landing at O’Hare.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.