Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Koh Young’s Answer to Wafer-level Inspection Challenges

11/12/2026 | Marcy LaRont, I-Connect007
At SEMICON West, I caught up with Allen Phung, head of sales at Koh Young America, where we pivoted from our more traditional focus on SMT-related tech to talking about semiconductors and advanced packaging. Koh Young’s semiconductor business provides inspection and metrology systems for advanced packaging, including micro-solder deposits, high-density substrates, and wafer-level packaging, addressing the demanding requirements as components shrink and interconnect complexity grows.

From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Nordson Completes Contrinex Acquisition to Expand Sensing Portfolio

10/26/2026 | Nordson
Nordson Corporation announced that it has acquired Contrinex, a global technology leader in high-performance sensors supporting factory automation and related solutions.

The Right Approach: The Top 5 Scariest Things About AI in PCB Fabrication

10/27/2026 | Steve Williams -- Column: The Right Approach
AI is already inside the PCB fabrication process, whether a shop has formally adopted it or not. Automated optical inspection (AOI) systems have used machine learning for years. CAM and DFM checks are increasingly AI-assisted, and quoting engines predict yield before a panel ever sees copper. None of that is inherently frightening; most of it is a genuine improvement over manual methods that were slower and just as fallible in their own ways.

Siemens, NVIDIA Advance AI-Powered PCB Inspection from Digital Twin to Factory

10/22/2026 | Siemens
Siemens announced a new collaboration with NVIDIA to develop adaptive AI-powered manufacturing capabilities that combine industrial software, Siemens’ Digital Twin technology and NVIDIA Cosmos to accelerate production planning, inspection preparation and optimization.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in