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Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone

09/04/2024 | I-Connect007
Don't miss the latest episode of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.

Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

Reassessing Surface Finish Performance for Next-gen Technology, Part 1

06/26/2023 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
Over the years, various surface finishes have been successfully utilized, namely organic solderability preservative (OSP), immersion silver (ImAg), immersion tin (ImSn), electroless nickel immersion gold (ENIG), and electroless nickel electroless palladium immersion gold (ENEPIG), as solderable finishes for PCB and package substrates. All these surface finishes have their pros and cons, with no single finish being suited to all applications. As system designers continue to respond to new performance demands, it can be noted that ENIG/ENEPIG finishes have endured as a leading choice in many advanced applications where reliability is prioritized over cost.

DFM 101: Final Finishes—OSP

03/09/2023 | Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. The next final finishes to discuss in this series is OSP. As with all surface finishes there are pros and cons with the decision of which to use. It is a combination of application, cost, and the properties of the finish. OSP is RoHS-compliant as there is zero lead content in the finish.
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